We can't find the internet
Attempting to reconnect
Something went wrong
Hang in there while we get back on track
£122.24
CRC Press Electronic Packaging Materials and Their Properties
Price data checked 6 days ago
We'll watch every seller, every day. One email when your price arrives.
This is the most expensive it has ever been. Walk away.
£122 today · previous high £122 · all-time low £101
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 85 days · 85 data points (no recent data)
Price Distribution
Price distribution over 85 days • 2 price levels
Price Analysis
Most common price: £101 (66 days, 77.6%)
Price range: £101 - £122
Price levels: 2 different prices over 85 days
Description
Key Features
This CRC Press book examines how packaging materials affect the reliability, design, and cost of electronic packaging systems.
The text covers material roles as electrical conductors or insulators and their use in creating structure and form.
Learn about materials that provide thermal paths and protect circuits from moisture, contamination, and radiation.
This resource outlines packaging architecture and the classification of materials for long-term performance.
This used book is provided in good condition for engineering and technology professionals.
Product Specifications
- Brand
- CRC Press
- Format
- hardcover
- ASIN
- 0849396255
- Domain
- Amazon UK
- Release Date
- 18 December 1998
- Listed Since
- 05 February 2007
Barcode
No barcode data available
Similar Products You Might Like
Electronic Equipment Packaging Technology
Springer
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Springer
3D Microelectronic Packaging: Architectures to Applications
Springer
Materials for Advanced Packaging
Springer
Materials for Advanced Packaging
Springer
Thermal Management Materials for Electronic Packaging - Wiley
Wiley
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Springer
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)
Springer
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
CRC Press
Hybrid Assemblies and Multichip Modules: 38 (Manufacturing Engineering and Materials Processing)
CRC Press
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
CRC Press
Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)
CRC Press
Microelectronic Materials
Routledge
William Andrew - Encapsulants for Electronic Applications
Elsevier
Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
Springer
Multichip Modules with Integrated Sensors: 16 (NATO Science Partnership Subseries: 3, 16)
Springer
Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
Springer
Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications, 141)
Springer
Electronics
CRC Press