Semiconductor Advanced Packaging - Image 1

£88.66

Springer Semiconductor Advanced Packaging

Name: Semiconductor Advanced Packaging
Brand: Springer
Price: 91.58 GBP
Availability: InStock

Electronics Engineering

Price History & Forecast

Last 2 days • 2 data points (No recent data available)

Historical

Generating forecast...

Price Distribution

Price distribution over 2 days • 2 price levels

Days at Price

Current Price

Price Analysis

Most common price: £89 (1 days, 50.0%)

Price range: £89 - £92

Price levels: 2 different prices over 2 days

Description

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Product Specifications

Brand: Springer
Format: paperback
ASIN: 9811613788
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering
Domain: Amazon UK
Release Date: 19 May 2022
Listed Since: 21 April 2022

Barcode

No barcode data available

Springer Semiconductor Advanced Packaging

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Semiconductor Advanced Packaging

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Materials for Advanced Packaging

Materials for Advanced Packaging

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Springer 3D Microelectronic Packaging - Advanced Microelectronics

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)

Semiconductor Packaging: Materials Interaction and Reliability

Semiconductor Packaging: Materials Interaction and Reliability

Wiley-Blackwell Advanced Electronic Packaging Book

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)

Essentials of Electronic Packaging: a Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging)

Thermal Stress and Strain in Microelectronics Packaging

Electronic Packaging Science and Technology

Wiley Quality Conformance of Microelectronic Packages Book

Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)

Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)

Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)

3D IC Integration and Packaging (ELECTRONICS)

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability