£88.66

Springer Semiconductor Advanced Packaging

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£89 today · usual range £0–£0 · best ever £77

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Price History & Forecast

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Last 452 days • 452 data points (No recent data available)

Historical
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£95.17 £75.46 £79.76 £84.06 £88.36 £92.66 £96.96 01 November 2024 21 February 2025 14 June 2025 05 October 2025 26 January 2026

Price Distribution

Price distribution over 452 days • 9 price levels

Days at Price
Current Price
28 days 32 days 125 days 52 days 135 days 1 day · current 33 days 18 days 28 days 0 34 68 101 135 £77 £78 £79 £80 £81 £89 £90 £92 £95 Days at Price

Price Analysis

Most common price: £81 (135 days, 29.9%)

Price range: £77 - £95

Price levels: 9 different prices over 452 days

Description

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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