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£94.98
Springer 3D Microelectronic Packaging - Advanced Microelectronics
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Description
Key Features
Comprehensive coverage of 3D microelectronic packaging fundamentals, architectures, and processing details for academic and professional use.
In-depth technical research on TSV, die processing, and micro-bumps for LMI and MMI applications.
Detailed insights into advanced materials and direct bonding techniques used in modern microelectronics.
Practical guidance on quality control, reliability testing, fault isolation, and failure analysis for 3D packages.
Includes didactic schematics, tables, and images to support complex technical learning and reference.
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 9811570892
- Domain
- Amazon UK
- Release Date
- 24 November 2020
- Listed Since
- 12 June 2020
Barcode
No barcode data available
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