We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
£127.08
Springer Compact Modeling: Principles, Techniques and Applications
Price data last checked 52 day(s) ago - refreshing...
We'll watch every seller, every day. One email when your price arrives.
This is the most expensive it has ever been. Walk away.
£127 today · previous high £127 · all-time low £126
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 39 days • 39 data points (No recent data available)
Price Distribution
Price distribution over 39 days • 2 price levels
Price Analysis
Most common price: £126 (38 days, 97.4%)
Price range: £126 - £127
Price levels: 2 different prices over 39 days
Description
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 9048186137
- Domain
- Amazon UK
- Release Date
- 08 September 2010
- Listed Since
- 09 November 2009
Barcode
No barcode data available
Similar Products You Might Like
Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications, 141)
Springer
Design of System on a Chip: Devices & Components
Springer
Springer 3D Microelectronic Packaging - Advanced Microelectronics
Springer
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics, 57)
Springer
Semiconductor Materials: An Introduction to Basic Principles (Microdevices)
Springer
More-than-Moore 2.5D and 3D SiP Integration
Springer
More-than-Moore 2.5D and 3D SiP Integration
Springer
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
Semiconductors: Part I: 58 (The IMA Volumes in Mathematics and its Applications, 58)
Springer
Simulation of Semiconductor Devices and Processes: Vol.5: v. 5 (Computational Microelectronics)
Springer
Semiconductor Modeling:: For Simulating Signal, Power, and Electromagnetic Integrity
Springer
Computer Aided Design of Micro- and Nanoelectronic Devices
World Scientific Publishing Company
Handbook of Digital CMOS Technology, Circuits, and Systems
Springer
Springer Handbook of Semiconductor Devices
Springer
3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
Springer
Entwurf integrierter 3D-Systeme der Elektronik
Springer
Semiconductor Advanced Packaging
Springer
Integrated Circuit Fabrication: Science and Technology
Printed Organic and Molecular Electronics
Springer
Semiconductor Devices: Diodes, Transistors, Solar Cells, Charge Coupled Devices and Solid State Lasers (Synthesis Lectures on Engineering, Science, and Technology)
Springer
Semiconductor Advanced Packaging
Predictive Simulation of Semiconductor Processing: Status and Challenges: 72 (Springer Series in Materials Science, 72)
Springer
Semiconductor Manufacturing Technology (Advanced Series in Electrical & Computer Engineering)
World Scientific Publishing Company