We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
£61.59
CRC Press Semiconductor Packaging: Materials Interaction and Reliability
Price data last checked 135 day(s) ago - refreshing...
We'll watch every seller, every day. One email when your price arrives.
Same price for 6 weeks. Today is much like next week.
£62 for 45 days straight · last change was Dec 2025
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 596 days • 596 data points (No recent data available)
Price Distribution
Price distribution over 596 days • 5 price ranges
Price Analysis
Most common range: £69-72 (161 days, 27.0%)
Price range: £55 - £72
Price levels: 5 price ranges over 596 days
Description
Product Specifications
- Brand
- CRC Press
- Format
- paperback
- ASIN
- 113807540X
- Domain
- Amazon UK
- Release Date
- 16 April 2017
- Listed Since
- 11 April 2017
Barcode
No barcode data available
Similar Products You Might Like
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
Semiconductor Advanced Packaging
Springer
Semiconductor Advanced Packaging
Springer 3D Microelectronic Packaging - Advanced Microelectronics
Springer
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics, 57)
Springer
Microelectronics Packaging Handbook: Semiconductor Packaging
Springer
Microelectronics Packaging Handbook: Technology Drivers Part I
Springer
CRC Press Electronic Packaging Materials and Their Properties
CRC Press
3D IC Integration and Packaging (ELECTRONICS)
McGraw-Hill Education
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
World Scientific Publishing Company
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Springer
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Springer
Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)
CRC Press
Semiconductor Manufacturing Technology (Advanced Series in Electrical & Computer Engineering)
World Scientific Publishing Company
Integrated Circuit Fabrication: Science and Technology
The Electronic Packaging Handbook (Electronics Handbook Series)
CRC Press
Handbook of Semiconductor Manufacturing Technology
CRC Press
Semiconductor Technology: Processing and Novel Fabrication Techniques
Wiley-Blackwell
Microelectronic Materials
CRC Press
Handbook of 3D Integration, Volume 3: 3D Process Technology
Wiley
Electronic Equipment Packaging Technology
Springer
Semiconductor Process Reliability in Practice (ELECTRONICS)
McGraw-Hill Education
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)
Springer
Compact Modeling: Principles, Techniques and Applications
Springer