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Description

Master the complex world of semiconductor fabrication with Technology of Integrated Circuits: 2 from the Springer Series in Advanced Microelectronics. Developed with strong involvement from SIEMENS Corp., this book provides an authoritative look at recent developments in process technologies for IC fabrication. The authors draw on extensive practical experience to deliver a resource that bridges the gap between theoretical knowledge and real-world application. This text covers essential topics including new materials, modern planar technology, and process designs for CMOS, Bipolar, BICMOS, and smart-power technologies. It also explores self-adjusting doping techniques, making it a comprehensive guide for those working in the field. Whether you are a professional in the semiconductor industry looking for an application-oriented guide or a senior student in electrical engineering or physics seeking a high-level textbook, this volume serves as a vital resource for understanding modern IC manufacturing.

Key Features

Provides authoritative knowledge based on practical experience and involvement with SIEMENS Corp. regarding IC fabrication developments.

Covers modern planar technology and new materials used in contemporary semiconductor manufacturing processes.

Detailed process designs included for CMOS, Bipolar, BICMOS, and smart-power technologies.

Explores advanced techniques such as self-adjusting doping for integrated circuit production.

Designed with a strong application-orientation to meet the needs of semiconductor industry professionals.

Serves as an ideal textbook for senior students studying electrical engineering and physics.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
06 July 2000
Listed Since
16 December 2006

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No barcode data available

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