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Springer Semiconductor Advanced Packaging

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£96.41 £91.59 £93.52 £95.45 £97.37 £99.30 £101.23 24 July 2026 30 July 2026 06 August 2026 12 August 2026 19 August 2026
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27 days 0 7 14 20 27 £96 Days at Price

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Description

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
18 May 2021
Listed Since
21 February 2021

Barcode

No barcode data available

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