£96.41

Semiconductor Advanced Packaging

Price data last checked 147 day(s) ago - refreshing...

View at Amazon

We'll watch every seller, every day. One email when your price arrives.

This is the usual price. Wait for it to drop, or tell us your number.

£96 today · usual range £0–£0 · best ever £88

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey
↓ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 584 days • 584 data points (No recent data available)

Historical
Generating forecast...
£129.99 £84.25 £94.23 £104.21 £114.19 £124.17 £134.15 09 June 2024 01 November 2024 27 March 2025 20 August 2025 13 January 2026

Price Distribution

Price distribution over 584 days • 4 price ranges

Days at Price
Current Price
335 days · current 86 days 159 days 4 days 0 84 168 251 335 £88-97 £97-105 £105-113 £122-130 Days at Price

Price Analysis

Most common range: £88-97 (335 days, 57.4%)

Price range: £88 - £130

Price levels: 4 price ranges over 584 days

Description

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
18 May 2021
Listed Since
21 February 2021

Barcode

No barcode data available

Similar Products You Might Like

Semiconductor Advanced Packaging
99% match

Semiconductor Advanced Packaging

Springer

£88.66 26 Jan 2026
Springer 3D Microelectronic Packaging - Advanced Microelectronics
98% match

Springer 3D Microelectronic Packaging - Advanced Microelectronics

Springer

£94.98 17 Apr 2026
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
98% match

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

£117.77 14 Jan 2026
Semiconductor Packaging: Materials Interaction and Reliability
98% match

Semiconductor Packaging: Materials Interaction and Reliability

CRC Press

£61.59 25 Jan 2026
Semiconductor Packaging: Materials Interaction and Reliability
98% match

Semiconductor Packaging: Materials Interaction and Reliability

CRC Press

£141.48 10 Feb 2026
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics, 57)
97% match

3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics, 57)

Springer

£131.11 09 Apr 2026
Chiplet Design and Heterogeneous Integration Packaging
97% match

Chiplet Design and Heterogeneous Integration Packaging

£92.42 08 Jan 2026
Chiplet Design and Heterogeneous Integration Packaging
97% match

Chiplet Design and Heterogeneous Integration Packaging

£96.24 14 Jan 2026
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
97% match

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)

Wiley-IEEE Press

£99.99 18 Apr 2026
3D IC Integration and Packaging (ELECTRONICS)
97% match

3D IC Integration and Packaging (ELECTRONICS)

McGraw-Hill Education

£180.31 12 Jan 2026
Materials for Advanced Packaging
97% match

Materials for Advanced Packaging

Springer

£192.00 09 Apr 2026
Materials for Advanced Packaging
97% match

Materials for Advanced Packaging

Springer

£95.90 12 Apr 2026
Handbook of Semiconductor Manufacturing Technology
97% match

Handbook of Semiconductor Manufacturing Technology

CRC Press

£190.66 09 Feb 2026
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
97% match

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)

World Scientific Publishing Company

£299.00 13 Dec 2025
Guide to Semiconductor Engineering
97% match

Guide to Semiconductor Engineering

World Scientific Publishing Company

£65.22 21 Feb 2026
Semiconductor Manufacturing Technology (Advanced Series in Electrical & Computer Engineering)
96% match

Semiconductor Manufacturing Technology (Advanced Series in Electrical & Computer Engineering)

World Scientific Publishing Company

£57.04 01 Apr 2026
Integrated Circuit Fabrication: Science and Technology
96% match

Integrated Circuit Fabrication: Science and Technology

£56.99 12 Jan 2026
Handbook of 3D Integration, Volume 3: 3D Process Technology
96% match

Handbook of 3D Integration, Volume 3: 3D Process Technology

Wiley

£92.19 09 Apr 2026
Semiconductor Materials: An Introduction to Basic Principles (Microdevices)
96% match

Semiconductor Materials: An Introduction to Basic Principles (Microdevices)

Springer

£80.98 08 Mar 2026
Microelectronics Packaging Handbook: Semiconductor Packaging
96% match

Microelectronics Packaging Handbook: Semiconductor Packaging

Springer

£272.43 10 Dec 2025
SemiConductor Wafer Bonding: Science and Technology: 33 (The ECS Series of Texts and Monographs)
96% match

SemiConductor Wafer Bonding: Science and Technology: 33 (The ECS Series of Texts and Monographs)

Wiley

£147.78 16 Feb 2026
Handbook of 3D Integration, Volume 1: Technology and Applications of 3D Integrated Circuits
96% match

Handbook of 3D Integration, Volume 1: Technology and Applications of 3D Integrated Circuits

£168.00 16 Dec 2025
Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition: A Practical Guide to Semiconductor Processing, Sixth Edition: A ... to Semiconductor Processing (ELECTRONICS)
96% match

Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition: A Practical Guide to Semiconductor Processing, Sixth Edition: A ... to Semiconductor Processing (ELECTRONICS)

McGraw-Hill Education

£136.15 13 Dec 2025
Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)
96% match

Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)

Springer

£339.24 14 Jan 2026