We can't find the internet
Attempting to reconnect
Something went wrong
Hang in there while we get back on track
£96.41
Springer Semiconductor Advanced Packaging
Price data last checked 38 day(s) ago - refreshing...
We'll watch every seller, every day. One email when your price arrives.
It has never been this cheap. We have no record of a lower price.
£96 today · cheaper than every other day in the last 3 months
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 53 days · 53 data points (no recent data)
Price Distribution
Price distribution over 53 days • 1 price levels
Price Analysis
Most common price: £96 (53 days, 100.0%)
Price range: £96 - £96
Price levels: 1 different prices over 53 days
Description
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 9811613753
- Domain
- Amazon UK
- Release Date
- 18 May 2021
- Listed Since
- 21 February 2021
Barcode
No barcode data available
Similar Products You Might Like
Semiconductor Advanced Packaging
Springer
Springer 3D Microelectronic Packaging - Advanced Microelectronics
Springer
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Springer
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Springer
Chiplet Design and Heterogeneous Integration Packaging
Springer
Chiplet Design and Heterogeneous Integration Packaging
Springer
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
Wiley-IEEE Press
3D IC Integration and Packaging (ELECTRONICS)
McGraw-Hill Education
Materials for Advanced Packaging
Springer
Materials for Advanced Packaging
Springer
Essentials of Electronic Packaging: a Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging)
ASME Press
Handbook of Semiconductor Manufacturing Technology
CRC Press
/uploads/images/products/2/B00S0YLJ0I/71ef5c75-b178-4007-9c52-fe74d31b2afd.webp
Springer
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
World Scientific Publishing Company
Guide to Semiconductor Engineering
World Scientific Publishing Company
Semiconductor Manufacturing Technology (Advanced Series in Electrical & Computer Engineering)
World Scientific Publishing Company
Guide To Semiconductor Engineering
World Scientific Publishing Company
Integrated Circuit Fabrication: Science and Technology
Cambridge University Press
Handbook of 3D Integration, Volume 3: 3D Process Technology
Wiley
Semiconductor Materials: An Introduction to Basic Principles (Microdevices)
Springer
Microelectronics Packaging Handbook: Semiconductor Packaging
Springer
SemiConductor Wafer Bonding: Science and Technology: 33 (The ECS Series of Texts and Monographs)
Wiley