Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press) - Image 1

£99.99

Wiley-IEEE Press Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)

Name: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
Brand: Wiley-IEEE Press
Price: 98.29 GBP
Availability: InStock

Electronics Engineering

Price History & Forecast

Last 84 days • 84 data points (No recent data available)

Historical

Generating forecast...

Price Distribution

Price distribution over 84 days • 3 price levels

Days at Price

Current Price

Price Analysis

Most common price: £100 (61 days, 72.6%)

Price range: £98 - £103

Price levels: 3 different prices over 84 days

Description

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.

Product Specifications

Brand: Wiley-IEEE Press
Format: hardcover
ASIN: 1119793777
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering
Domain: Amazon UK
Release Date: 07 December 2021
Listed Since: 23 August 2021

Barcode

No barcode data available

Wiley-IEEE Press Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Wiley-Blackwell Advanced Electronic Packaging Book

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Antenna-in-Package Technology and Applications (IEEE Press)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Managing Power Electronics: VLSI and DSP-Driven Systems

Wiley Quality Conformance of Microelectronic Packages Book

Electronic Packaging Science and Technology

Microelectronic Packaging (New Trends in Electrochemical Technology)

Thermal Stress and Strain in Microelectronics Packaging

The Electronic Packaging Handbook (Electronics Handbook Series)

Essentials of Electronic Packaging: a Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging)

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

CRC Press - Introduction to Microsystem Packaging Technology

Wiley Embedded Systems: Hardware, Design and Implementation

Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

Advanced FPGA Design: Architecture, Implementation, and Optimization (IEEE Press)

Wiley Thermal Management Materials for Electronic Packaging

Advanced Circuits for Emerging Technologies