We can't find the internet
Attempting to reconnect
Something went wrong
Hang in there while we get back on track
£101.79
It has never been this cheap. We have no record of a lower price.
£102 today · cheaper than every other day in the last 3 months
Wiley Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
We'll watch every seller, every day. One email when your price arrives.
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 70 days · 70 data points (no recent data)
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price Distribution
Price distribution over 70 days • 1 price levels
Price Analysis
Most common price: £102 (70 days, 100.0%)
Price range: £102 - £102
Price levels: 1 different prices over 70 days
Description
Product Specifications
- Brand
- Wiley
- Format
- hardcover
- ASIN
- 1119793777
- Domain
- Amazon UK
- Release Date
- 07 December 2021
- Listed Since
- 23 August 2021
Barcode
No barcode data available
Similar Products You Might Like
Semiconductor Advanced Packaging
Springer
Springer Semiconductor Advanced Packaging Engineering Book
Springer
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Springer
3D Microelectronic Packaging: Architectures to Applications
Springer
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Springer
3D Integration for VLSI Systems
Taylor & Francis
Chiplet Design and Heterogeneous Integration Packaging
Springer
Chiplet Design and Heterogeneous Integration Packaging
Springer
Fan-Out Wafer-Level Packaging
Springer
3D IC Integration and Packaging (ELECTRONICS)
McGraw-Hill Education
Chiplet-Based System-on-a-Chip (SoC) Architecture: Future of Advanced Computing
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
Semiconductor Packaging: Materials Interaction and Reliability
CRC Press
Technology of Integrated Circuits Vol 2 - Springer Series Advanced Microelectronics
Springer
Essentials of Electronic Packaging: a Multidisciplinary Approach (Electronic Packaging Book Series) (Asme Press Book Series on Electronic Packaging)
ASME Press
Wafer Scale Integration - Springer Technical Reference
Springer
Wafer Scale Integration
Springer
Handbook of 3D Integration, Volume 1: Technology and Applications of 3D Integrated Circuits
Wiley
Microelectronics Packaging Handbook: Semiconductor Packaging
Springer
Flexible Electronic Packaging and Encapsulation Technology - Wiley
Wiley
Electronic Packaging Science and Technology
Wiley
VLSI-SoC: Research Trends in VLSI and Systems on Chip: Fourteenth International Conference on Very Large Scale Integration of System on Chip ... and Communication Technology, 249)
Springer
Oxford Fabrication Engineering at the Micro and Nanoscale
Oxford University Press
Microelectronics Packaging Handbook: Technology Drivers Part I
Springer