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£165.66
Springer Wafer Scale Integration - Springer Technical Reference
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Description
Key Features
Wafer Scale Integration by Springer covers the complete fabrication and testing process for creating multi-cell systems directly on silicon wafers.
The book compares traditional VLSI dice-and-package methods with WSI approaches that interconnect good cells while keeping signal lines on the wafer.
Learn how low stray capacitance in Wafer Scale Integration systems enables high-speed operation without the overhead of conventional chip packaging.
This technical reference explores cell types, multiple instances, and interconnection strategies essential to understanding modern wafer-scale design.
Used book in good condition offers an affordable way to access Springer's authoritative treatment of integrated circuit fabrication technology.
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 0792390032
- Domain
- Amazon UK
- Release Date
- 31 March 1989
- Listed Since
- 16 February 2007
Barcode
No barcode data available
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