Springer Wafer Scale Integration - Technical Engineering Book

Explore the advanced concepts of semiconductor design with Wafer Scale Integration by Springer. This technical resource examines the evolution of integrated circuits, moving beyond traditional VLSI methods to explore the potential of entire wafers as single systems. While standard VLSI chips involve fabricating hundreds of identical circuits on a single wafer before dicing and packaging, Wafer Scale Integration offers a different approach. This book details how wafers are fabricated with multiple types of circuits, known as cells, which are tested and interconnected to create a functional system on the wafer itself. Because most signal lines remain on the wafer, this method results in low stray capacitance, allowing for high speeds. This text is an essential study for those interested in the quest for larger integrated circuits and the technical methods used to realize complex systems on a wafer scale.