Price loading...

Chiplet Design and Heterogeneous Integration Packaging

Nanotechnology

Price data last checked 101 day(s) ago - refreshing...

View at Amazon

Price History & Forecast

No Price Data Available

Price history will appear here once data is collected from Amazon.

Price Distribution

No price data available for histogram

Description

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Product Specifications

Format: hardcover
ASIN: 9811999163
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electrical > Nanotechnology
Domain: Amazon UK
Release Date: 28 March 2023
Listed Since: 17 December 2022

Barcode

No barcode data available

Chiplet Design and Heterogeneous Integration Packaging

Price History & Forecast

No Price Data Available

Price Distribution

Description

Product Specifications

Barcode

Similar Products You Might Like

Chiplet Design and Heterogeneous Integration Packaging

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Heterogeneous Integrations

Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

Wiley Quality Conformance of Microelectronic Packages Book

Electronic Packaging Science and Technology

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Thermal Stress and Strain in Microelectronics Packaging

3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization

Materials for Advanced Packaging

Materials for Advanced Packaging

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Semiconductor Packaging: Materials Interaction and Reliability

Semiconductor Packaging: Materials Interaction and Reliability

Wiley-Blackwell Advanced Electronic Packaging Book

Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation

Enabling the Internet of Things: From Integrated Circuits to Integrated Systems

Conceptual Design of Multichip Modules and Systems: 250 (The Springer International Series in Engineering and Computer Science, 250)

Networks on Chip

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Design Technology for Heterogeneous Embedded Systems