Springer Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Handbook of Digital CMOS Technology, Circuits, and Systems

Springer

Multichip Module Technologies and Alternatives: The Basics

Springer

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Springer

Wiley Quality Conformance of Microelectronic Packages Book

Wiley

CMOS Multichannel Single-Chip Receivers for Multi-Gigabit Optical Data Communications (Analog Circuits and Signal Processing)

Springer

Networks on Chip

Springer

Fundamentals of Semiconductor Processing Technology

Springer

Conceptual Design of Multichip Modules and Systems: 250 (The Springer International Series in Engineering and Computer Science, 250)

Springer

Networks-on-Chips: Theory and Practice (Embedded Multi-Core Systems)

CRC Press

Enabling the Internet of Things: From Integrated Circuits to Integrated Systems

Springer

Chiplet-Based System-on-a-Chip (SoC) Architecture: Future of Advanced Computing

Memory Issues in Embedded Systems-on-Chip: Optimizations and Exploration

Springer

Design for Manufacturability: From 1D to 4D for 90–22 nm Technology Nodes

Springer

Design of System on a Chip: Devices & Components

Springer

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Wiley

A Practical Approach to VLSI System on Chip (SoC) Design: A Comprehensive Guide

Springer

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Springer

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Springer

Design for Manufacturability and Yield for Nano-Scale CMOS (Integrated Circuits and Systems)

Springer

CHIP SCALE PACKAGE, CSP (McGraw-Hill Electronic Packaging and Interconnection Series)

MCGRAW-HILL PROFESSIONAL