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£92.17
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£92 today · cheaper than every other day in the last 3 months
Springer 3D Interconnect Architectures for Heterogeneous Tech
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Most common price: £92 (22 days, 100.0%)
Price range: £92 - £92
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Description
Key Features
This Springer publication provides a comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs).
The text addresses specific challenges and opportunities that arise from heterogeneous integration in modern computing.
Readers learn to maximize gains from 3D technology through architecture design that accounts for physical effects.
The book covers the physical implications of using heterogeneous 3D technologies for SoC integration.
It offers a deep theoretical background across all abstraction levels needed to research future 3D-integrated circuits.
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 3030982319
- Category
- Books > Subjects > Computing & Internet > Computer Science > Architecture & Microprocessors
- Domain
- Amazon UK
- Release Date
- 29 June 2023
- Listed Since
- 01 June 2023
Barcode
No barcode data available
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