£72.09

Springer Testing of Interposer-Based 2.5D Integrated Circuits

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£72 today · all-time low £69 (Jul 2024) · usually the usual

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£72.45 £68.84 £69.63 £70.42 £71.20 £71.99 £72.78 09 June 2024 14 November 2024 22 April 2025 27 September 2025 05 March 2026

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Description

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
29 March 2017
Listed Since
01 February 2017

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