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£72.09
Springer Testing of Interposer-Based 2.5D Integrated Circuits
Price data last checked 51 day(s) ago - refreshing...
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Last 40 days • 40 data points (No recent data available)
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Price distribution over 40 days • 1 price levels
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Most common price: £72 (40 days, 100.0%)
Price range: £72 - £72
Price levels: 1 different prices over 40 days
Description
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 3319547135
- Category
- Books > Subjects > Computing & Internet > Computer Science > Architecture & Microprocessors
- Domain
- Amazon UK
- Release Date
- 29 March 2017
- Listed Since
- 01 February 2017
Barcode
No barcode data available
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