Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) - Image 1

Price loading...

Springer Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

Name: Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Brand: Springer

Applied Optics

Price History & Forecast

No Price Data Available

Price history will appear here once data is collected from Amazon.

Price Distribution

No price data available for histogram

Description

Product Description This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry. From the Back Cover Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration. Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.

Product Specifications

Brand: Springer
Format: paperback
ASIN: 1441945628
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering > Applied Optics
Domain: Amazon UK
Release Date: 08 December 2010
Listed Since: 06 July 2010

Barcode

No barcode data available

Springer Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

Price History & Forecast

No Price Data Available

Price Distribution

Description

Product Specifications

Barcode

Similar Products You Might Like

3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems)

Advances In 3D Integrated Circuits And Systems: 1 (Series on Emerging Technologies in Circuits and Systems)

3D IC Integration and Packaging (ELECTRONICS)

3D IC Stacking Technology (ELECTRONICS)

Design of 3D Integrated Circuits and Systems (Devices, Circuits, and Systems)

Handbook of 3D Integration, Volume 1: Technology and Applications of 3D Integrated Circuits

Design of 3D Integrated Circuits and Systems: Multicore Architecture, Thermal Management, and Reliability: 33 (Devices, Circuits, and Systems)

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

3D and Circuit Integration of MEMS

3D Flash Memories

3D Flash Memories

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Testing of Interposer-Based 2.5D Integrated Circuits

Vertical 3D Memory Technologies

3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization

Springer Wafer Scale Integration - Technical Engineering Book

3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme

Advanced Circuits for Emerging Technologies

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

CRC Press Physical Design for 3D Integrated Circuits Book

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration