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£39.76

Springer 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Name: 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Brand: Springer
Price: 39.76 GBP
Availability: InStock

Architecture & Microprocessors

About as cheap as it gets. The only time it was cheaper was 2 months ago.

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Description

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Product Specifications

Brand: Springer
Format: hardcover
ASIN: 3319204807
Category: Books > Subjects > Computing & Internet > Computer Science > Architecture & Microprocessors
Domain: Amazon UK
Release Date: 06 January 2016
Listed Since: 13 May 2015

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Springer 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

About as cheap as it gets. The only time it was cheaper was 2 months ago.

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