£107.29

This is the most expensive it has ever been. Walk away.

£107 today · previous high £107 · all-time low £103

Springer - Three-Dimensional Integration of Semiconductors

Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 66 days · 66 data points (no recent data)

Historical
Generating forecast…
£107.29 £102.86 £103.82 £104.79 £105.76 £106.73 £107.69 28 July 2026 13 August 2026 29 August 2026 14 September 2026 01 October 2026
View at Amazon ↗

Price data last checked 25 day(s) ago - will refresh soon

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 66 days • 2 price levels

Days at Price
Current Price
60 days 6 days · current 0 15 30 45 60 £103 £107 Days at Price

Price Analysis

Most common price: £103 (60 days, 90.9%)

Price range: £103 - £107

Price levels: 2 different prices over 66 days

Description

Explore the fundamentals and advancements of semiconductor technology with this comprehensive guide from Springer. This book provides a deep look into three-dimensional integration, focusing on how these systems achieve low energy consumption and high speed image processing. Readers will learn the specific methods used to construct these technologies and the selection of materials required for different technical situations. The text covers a wide range of practical applications, from next generation smart phones and driving assistance systems to specialized tools like capsule endoscopes and homing missiles. By examining recent progress in three dimensional packaging and discussing future prospects, this resource serves as an essential guide for those working in biomedical engineering and advanced semiconductor processing.

Key Features

This Springer publication covers the background of three-dimensional integration, including benefits like high speed image processing and low energy consumption.

Learn the technical methods for constructing semiconductor systems and the selection of specific materials for various use cases.

The text details numerous real-world applications such as next generation smart phones and driving assistance systems.

Explore specialized implementations in medical and defense technology, including capsule endoscopes and homing missiles.

Stay updated with information on recent progress in three dimensional packaging and future development prospects.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
28 March 2019
Listed Since
20 December 2018

Barcode

No barcode data available

Similar Products You Might Like

Handbook of 3D Integration, Volume 3: 3D Process Technology
96% match

Handbook of 3D Integration, Volume 3: 3D Process Technology

Wiley

£92.19 30 Sep 2026
3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
96% match

3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)

Springer

£156.40 30 Sep 2026
3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
96% match

3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)

Springer

£83.07 25 Sep 2026
3D Microelectronic Packaging: Architectures to Applications
96% match

3D Microelectronic Packaging: Architectures to Applications

Springer

£110.98 02 Oct 2026
Entwurf integrierter 3D-Systeme der Elektronik
95% match

Entwurf integrierter 3D-Systeme der Elektronik

Springer

£47.12 18 Sep 2026
Semiconductor Materials and Process Technology Handbook (VLSI AND ULTRA LARGE SCALE INTEGRATION)
95% match

Semiconductor Materials and Process Technology Handbook (VLSI AND ULTRA LARGE SCALE INTEGRATION)

Elsevier

£126.77 22 Sep 2026
Semiconductor Materials: An Introduction to Basic Principles (Microdevices)
95% match

Semiconductor Materials: An Introduction to Basic Principles (Microdevices)

Springer

£81.56 23 Sep 2026
Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications, 141)
95% match

Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications, 141)

Springer

£62.16 24 Sep 2026
Compact Modeling: Principles, Techniques and Applications
95% match

Compact Modeling: Principles, Techniques and Applications

Springer

£122.70 02 Oct 2026
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
95% match

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Springer

£39.77 23 Sep 2026
Low-Dimensional Semiconductors: Materials, Physics, Technology, Devices: 3 (Series on Semiconductor Science and Technology)
95% match

Low-Dimensional Semiconductors: Materials, Physics, Technology, Devices: 3 (Series on Semiconductor Science and Technology)

Oxford University Press

£118.49 19 Sep 2026
Printed Organic and Molecular Electronics
95% match

Printed Organic and Molecular Electronics

Springer

£166.59 24 Sep 2026
Crucial Issues in Semiconductor Materials and Processing Technologies: (Closed)): 222 (NATO Science Series E:)
95% match

Crucial Issues in Semiconductor Materials and Processing Technologies: (Closed)): 222 (NATO Science Series E:)

Springer

£159.82 01 Oct 2026
Semiconductor Manufacturing Technology (ADVANCED SERIES IN ELECTRICAL AND COMPUTER ENGINEERING)
95% match

Semiconductor Manufacturing Technology (ADVANCED SERIES IN ELECTRICAL AND COMPUTER ENGINEERING)

World Scientific Publishing Company

£53.80 29 Sep 2026
Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
95% match

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

Springer

£144.67 30 Sep 2026
Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
95% match

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

Springer

£38.74 30 Sep 2026
Semiconductor Spintronics
95% match

Semiconductor Spintronics

World Scientific Publishing Company

£106.00 24 Sep 2026
3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
95% match

3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics

Springer

£129.99 19 Sep 2026