£102.99

Springer - Three-Dimensional Integration of Semiconductors

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Description

Explore the evolving landscape of semiconductor technology with this comprehensive guide from Springer. This book provides a deep look into three-dimensional integration, starting with the fundamental background of the field. Readers will learn about the advantages of 3D integration, such as high speed image processing and low energy consumption. The text guides you through the practical aspects of construction and the selection of specific materials for different technical requirements. By understanding how to build these systems, engineers and researchers can better navigate the complexities of modern semiconductor design. Beyond theory, this book examines real-world applications that drive modern technology. Topics include the development of next generation smart phones, driving assistance systems, capsule endoscopes, and homing missiles. The content concludes with a look at recent progress in three dimensional packaging and provides insight into future prospects for the industry. This is an essential resource for those working in biomedical engineering and advanced semiconductor manufacturing.

Key Features

Learn the fundamentals of three-dimensional integration including its role in low energy consumption and high speed image processing.

Gain practical knowledge on how to construct semiconductor systems and select the right materials for specific technical situations.

Explore a wide range of applications from next generation smart phones to driving assistance systems and homing missiles.

Understand specialized uses in medical technology such as the development of capsule endoscopes.

Stay updated on the industry with coverage of recent progress in three dimensional packaging and future technological prospects.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
28 March 2019
Listed Since
20 December 2018

Barcode

No barcode data available

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