Springer Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

Springer

Nanopackaging: Nanotechnologies and Electronics Packaging

Springer

Electronic Structure of Semiconductor Interfaces (Synthesis Lectures on Engineering, Science, and Technology)

Materials for Advanced Packaging

Springer

Materials for Advanced Packaging

Springer

Semiconductor Advanced Packaging

Springer

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Springer - Three-Dimensional Integration of Semiconductors

Springer

Semiconductor Advanced Packaging

Semiconductor Materials: An Introduction to Basic Principles (Microdevices)

Springer

Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

Springer

Materials for Electronic, Magnetic, and Spintronic Technologies: Characterization and Applications from Energy Storage to Disease Detection (Engineering Materials)

Springer

Materials for Electronic, Magnetic, and Spintronic Technologies: Characterization and Applications from Energy Storage to Disease Detection (Engineering Materials)

Manufacturing Technology in the Electronics Industry: An introduction

Springer

Ceramic-Matrix Composites

Springer

Nano-Energetic Materials (Energy, Environment, and Sustainability)

Springer

Biobased Packaging Materials: Sustainable Alternative to Conventional Packaging Materials

Low-Dimensional and Nanostructured Materials and Devices: Properties, Synthesis, Characterization, Modelling and Applications (NanoScience and Technology)

Springer

Springer Low Dielectric Constant Materials for IC Applications

Springer

Springer - Semiconductor-On-Insulator Materials for Nanoelectronics

Springer

Electronic Equipment Packaging Technology

Springer

CRC Press Electronic Packaging Materials and Their Properties

CRC Press

Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)

Springer