£109.00

CRC Press Physical Design for 3D Integrated Circuits Book

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Description

Master the complexities of modern semiconductor technology with Physical Design for 3D Integrated Circuits. This technical reference provides a clear roadmap for designing 3D integrated circuits (ICs) effectively and optimally. By moving beyond conventional 2D circuit limitations, this book helps engineers and researchers understand how to exploit the specific benefits of 3D technology. Readers gain a deep understanding of the physical design challenges that arise when transitioning from 2D to 3D architectures. The text analyzes various design tools and provides state-of-the-art solutions for the unique hurdles found in 3D IC environments. Whether you are studying monolithic 3D ICs or working with 2.5D/3D configurations, this resource delivers the technical depth required for advanced microarchitecture and microprocessor development.

Key Features

Provides extensive coverage of both 2.5D/3D ICs and monolithic 3D IC design methodologies.

Analyzes specialized design tools specifically developed for 3D circuit implementation.

Offers state-of-the-art solutions to address challenges unique to 3D integrated circuit environments.

Compares physical design challenges between conventional 2D circuits and modern 3D technology.

Delivers in-depth technical looks at specific physical design topics through dedicated chapters.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
29 December 2015
Listed Since
17 June 2015

Barcode

No barcode data available

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