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CRC Press Physical Design for 3D Integrated Circuits - Devices, Circuits, Systems

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Description

Physical Design for 3D Integrated Circuits is a comprehensive guide that equips engineers and designers with essential knowledge for optimising 3D IC architecture and implementation. This authoritative reference from CRC Press explores the distinct physical design challenges that differentiate 3D integrated circuits from conventional 2D designs, providing in-depth analysis of design tools and methodologies specific to three-dimensional chip technology. The book delivers extensive coverage of both 2.5D/3D ICs and monolithic 3D ICs, offering state-of-the-art solutions to overcome the unique engineering obstacles inherent to three-dimensional circuit design. Each chapter examines specific physical design topics in detail, making this volume an indispensable resource for professionals working in advanced semiconductor development, circuit design optimisation, and next-generation IC manufacturing.

Key Features

Comprehensive examination of physical design challenges unique to 3D integrated circuits versus traditional 2D circuit architectures.

Extensive coverage of both 2.5D/3D IC design and monolithic 3D IC implementation strategies from CRC Press.

In-depth analysis of design tools and software specifically developed for three-dimensional circuit optimisation.

State-of-the-art solutions addressing the technical obstacles specific to 3D integrated circuit physical design.

Chapter-by-chapter exploration of individual physical design topics relevant to advanced semiconductor engineering.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
29 December 2015
Listed Since
17 June 2015

Barcode

No barcode data available

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