£165.80

This is the most expensive it has ever been. Walk away.

£166 today · previous high £166 · all-time low £166

Springer Multichip Module Technologies and Alternatives: The Basics

Amazon

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 26 days · 26 data points (no recent data)

Historical
Generating forecast…
£165.80 £165.78 £165.78 £165.79 £165.79 £165.80 £165.80 25 July 2026 31 July 2026 06 August 2026 12 August 2026 19 August 2026
View at Amazon ↗

Price data last checked 65 day(s) ago - refreshing...

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↑ Price chart
when this has been cheap or pricey
↑ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price Distribution

Price distribution over 26 days • 1 price levels

Days at Price
26 days 0 7 13 20 26 £166 Days at Price

Price Analysis

Most common price: £166 (26 days, 100.0%)

Price range: £166 - £166

Price levels: 1 different prices over 26 days

Description

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
31 October 1992
Listed Since
09 February 2007

Barcode

No barcode data available

Similar Products You Might Like

CHIP SCALE PACKAGE, CSP (McGraw-Hill Electronic Packaging and Interconnection Series)
97% match

CHIP SCALE PACKAGE, CSP (McGraw-Hill Electronic Packaging and Interconnection Series)

McGraw-Hill Education

£53.99 21 Oct 2026
CRC Press Unique Chips and Systems Computer Engineering Book
96% match

CRC Press Unique Chips and Systems Computer Engineering Book

CRC Press

£171.99 05 Oct 2026
Microelectronics Packaging Handbook: Semiconductor Packaging
96% match

Microelectronics Packaging Handbook: Semiconductor Packaging

Springer

£278.97 11 Aug 2026
Microelectronics Packaging Handbook: Technology Drivers Part I
96% match

Microelectronics Packaging Handbook: Technology Drivers Part I

Springer

£148.72 20 Aug 2026
VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI ’99) December 1–4, 1999, Lisboa, ... Information and Communication Technology, 34)
96% match

VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI ’99) December 1–4, 1999, Lisboa, ... Information and Communication Technology, 34)

Springer

£165.34 19 Aug 2026
Wiley Microelectronic Package Quality and Qualification Book
96% match

Wiley Microelectronic Package Quality and Qualification Book

Wiley

£123.39 01 Oct 2026
Chiplet-Based System-on-a-Chip (SoC) Architecture: Future of Advanced Computing
96% match

Chiplet-Based System-on-a-Chip (SoC) Architecture: Future of Advanced Computing

£79.00 14 Aug 2026
Microelectronics Packaging Handbook: Technology Drivers Part I: 1
96% match

Microelectronics Packaging Handbook: Technology Drivers Part I: 1

Springer

£152.66 08 Oct 2026
Oxford University Press - The Man Behind the Microchip Book
96% match

Oxford University Press - The Man Behind the Microchip Book

Oxford University Press

£66.00 01 Sep 2026
VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI ’99) December 1–4, 1999, Lisboa, ... Information and Communication Technology, 34)
96% match

VLSI: Systems on a Chip: IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI ’99) December 1–4, 1999, Lisboa, ... Information and Communication Technology, 34)

Springer

£179.99 08 Oct 2026
Chiplet Design and Heterogeneous Integration Packaging
96% match

Chiplet Design and Heterogeneous Integration Packaging

Springer

£126.85 20 Aug 2026
Chiplet Design and Heterogeneous Integration Packaging
96% match

Chiplet Design and Heterogeneous Integration Packaging

Springer

£89.28 14 Aug 2026
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
96% match

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Springer

£122.30 20 Aug 2026
芯片简史
96% match

芯片简史

IngramSpark

£33.46 02 Oct 2026
3D Integration for VLSI Systems
96% match

3D Integration for VLSI Systems

Taylor & Francis

£103.10 05 Oct 2026
Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)
96% match

Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)

Springer

£431.84 20 Aug 2026
Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)
96% match

Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)

Springer

£408.93 14 Aug 2026
VLSI-SoC: Research Trends in VLSI and Systems on Chip: Fourteenth International Conference on Very Large Scale Integration of System on Chip ... and Communication Technology, 249)
96% match

VLSI-SoC: Research Trends in VLSI and Systems on Chip: Fourteenth International Conference on Very Large Scale Integration of System on Chip ... and Communication Technology, 249)

Springer

£76.42 14 Oct 2026
Microelectronic Packaging (New Trends in Electrochemical Technology)
96% match

Microelectronic Packaging (New Trends in Electrochemical Technology)

CRC Press

£290.00 24 Aug 2026
Advances In 3D Integrated Circuits And Systems: 1 (SERIES ON EMERGING TECHNOLOGIES IN CIRCUITS AND SYSTEMS)
96% match

Advances In 3D Integrated Circuits And Systems: 1 (SERIES ON EMERGING TECHNOLOGIES IN CIRCUITS AND SYSTEMS)

World Scientific Publishing Company

£56.54 18 Sep 2026
Semiconductor Advanced Packaging
96% match

Semiconductor Advanced Packaging

Springer

£96.41 19 Aug 2026
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
96% match

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Springer

£39.77 23 Sep 2026
Wafer Scale Integration
96% match

Wafer Scale Integration

Springer

£144.56 24 Sep 2026
Introduction to VLSI Silicon Devices - Physics & Technology
96% match

Introduction to VLSI Silicon Devices - Physics & Technology

Springer

£113.76 06 Oct 2026