We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
£121.35
Wiley Quality Conformance of Microelectronic Packages Book
Price data last checked 14 day(s) ago - will refresh soon
Price History & Forecast
Last 77 days • 77 data points (No recent data available)
Price Distribution
Price distribution over 77 days • 3 price levels
Price Analysis
Most common price: £120 (48 days, 62.3%)
Price range: £118 - £121
Price levels: 3 different prices over 77 days
Description
Key Features
Shifts focus from outdated government standards to modern, science-based failure analysis.
Provides methods to identify and address the actual root causes of product failure.
Helps engineers implement cost-effective process controls and quality screens.
Offers a new approach to testing that addresses specific manufacturing processes.
Designed for packaging engineers seeking to improve product reliability and cost-efficiency.
Product Specifications
- Brand
- Wiley
- Format
- hardcover
- ASIN
- 0471594369
- Domain
- Amazon UK
- Release Date
- 05 January 1995
- Listed Since
- 15 December 2006
Barcode
No barcode data available
Similar Products You Might Like
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Wiley
Wiley-Blackwell Advanced Electronic Packaging Book
Wiley-Blackwell
Electronic Packaging Science and Technology
Wiley
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
Springer
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
World Scientific Publishing Company
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
CRC Press
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Springer
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Springer
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Woodhead Publishing
Micro-Manufacturing: Design and Manufacturing of Micro-Products
Wiley
The Electronic Packaging Handbook (Electronics Handbook Series)
CRC Press
Thermal Stress and Strain in Microelectronics Packaging
Springer
Reliability and Failure of Electronic Materials and Devices
Academic Press
Microelectronic Packaging (New Trends in Electrochemical Technology)
CRC Press
Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)
CRC Press
Semiconductor Advanced Packaging
3D IC Integration and Packaging (ELECTRONICS)
McGraw-Hill Education
Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems: 4 (Quality and Reliability Engineering Series)
Wiley
Antenna-in-Package Technology and Applications (IEEE Press)
Wiley-IEEE Press
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)
Springer
Protective Packaging for Distribution: Design and Development
DEStech Publications, Inc
Electronic Components: Selection and Application Guidelines
Wiley
Semiconductor Advanced Packaging
Springer
Reliability and Failure of Electronic Materials and Devices
Academic Press