Hybrid Assemblies and Multichip Modules: 38 (Manufacturing Engineering and Materials Processing) - Image 1

£86.30

CRC Press Hybrid Assemblies and Multichip Modules: 38 (Manufacturing Engineering and Materials Processing)

Name: Hybrid Assemblies and Multichip Modules: 38 (Manufacturing Engineering and Materials Processing)
Brand: CRC Press
Price: 30.0 GBP
Availability: InStock

Industrial Design

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Description

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

Product Specifications

Brand: CRC Press
Model: 1
Format: hardcover
ASIN: 0824784669
Category: Books > Subjects > Arts & Photography > Decorative Arts & Design > Industrial Design
Domain: Amazon UK
Release Date: 16 December 1992
Listed Since: 10 February 2007

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CRC Press Hybrid Assemblies and Multichip Modules: 38 (Manufacturing Engineering and Materials Processing)

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