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Elsevier Hybrid Microcircuit Technology Handbook - Materials & Design

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Description

The Hybrid Microcircuit Technology Handbook is a comprehensive reference covering the complete lifecycle of hybrid circuit production, from materials selection through final testing. This essential guide integrates thin film and thick film technologies alongside assembly processes, addressing critical manufacturing techniques including resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. The handbook includes dedicated chapters on substrate selection, electrostatic discharge handling, failure analysis documentation, and practical design guidelines to ensure reliable circuits at high yields. Whether you are designing hybrid segments, optimising fabrication processes, or troubleshooting production challenges, this materials science resource provides the technical depth needed for successful hybrid microcircuit development and manufacturing.

Key Features

Covers resistor trimming, wire bonding, die attachment, and hermetic sealing techniques essential to hybrid microcircuit fabrication.

Includes comprehensive design guidelines and substrate selection criteria for reliable hybrid circuit production.

Addresses thin film and thick film technologies alongside complete assembly and testing processes for hybrid segments.

Features chapters on electrostatic discharge handling, failure analysis, and production documentation to prevent defects.

Provides moisture analysis and cleaning protocols required for high-yield manufacturing of hybrid microcircuits.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
01 December 1995
Listed Since
16 February 2007

Barcode

No barcode data available

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