£135.00

William Andrew Hybrid Microcircuit Technology Handbook

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Description

Master the complexities of circuit production with the Hybrid Microcircuit Technology Handbook. This comprehensive guide from the Materials Science and Process Technology Series integrates the diverse technologies required for the design, fabrication, assembly, and testing of hybrid segments. It is an essential resource for achieving high yields and producing reliable circuits. This handbook covers a wide range of technical processes, including resistor trimming, wire bonding, die attachment, and cleaning. You will find detailed information on hermetic sealing, moisture analysis, and both thin and thick film processes. Beyond assembly, the text provides guidance on substrate selection, electrostatic discharge (ESD) handling, and documentation practices. For engineers and researchers, the book offers a complete look at failure analysis and a dedicated chapter on design guidelines. Whether you are working on material selection or production management, this handbook provides the technical foundation needed for success in modern microcircuit technology.

Key Features

Covers essential fabrication and assembly processes including resistor trimming, wire bonding, and die attachment for reliable circuit production.

Provides technical guidance on thin films, thick films, and substrate selection to support diverse manufacturing needs.

Includes vital information on testing and quality control through moisture analysis, cleaning, and hermetic sealing processes.

Addresses critical handling requirements such as electrostatic discharge (ESD) and detailed documentation for production workflows.

Offers specialized knowledge in failure analysis and a comprehensive chapter focused on design guidelines.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
01 December 1995
Listed Since
16 February 2007

Barcode

No barcode data available

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