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Springer Multichip Modules with Integrated Sensors: 16 (NATO Science Partnership Subseries: 3, 16)

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Description

Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.

Key Features

Used Book in Good Condition

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
31 October 1996
Listed Since
15 December 2006

Barcode

No barcode data available

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