Microelectronic Packaging (New Trends in Electrochemical Technology) - Image 1

£239.58

CRC Press Microelectronic Packaging (New Trends in Electrochemical Technology)

Name: Microelectronic Packaging (New Trends in Electrochemical Technology)
Brand: CRC Press
Price: 239.58 GBP
Availability: InStock

Decorative Arts & Design

This is the most expensive it has ever been. Walk away.

£240 today · previous high £240 · all-time low £239

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 56 days · 56 data points (no recent data)

Historical

Generating forecast…

Price Distribution

Price distribution over 56 days • 1 price levels

Days at Price

Price Analysis

Most common price: £240 (56 days, 100.0%)

Price range: £240 - £240

Price levels: 1 different prices over 56 days

Description

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Product Specifications

Brand: CRC Press
Format: hardcover
ASIN: 041531190X
Category: Books > Subjects > Arts & Photography > Decorative Arts & Design
Domain: Amazon UK
Release Date: 20 December 2004
Listed Since: 09 February 2007

Barcode

No barcode data available

CRC Press Microelectronic Packaging (New Trends in Electrochemical Technology)

This is the most expensive it has ever been. Walk away.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)

Microelectronic Materials and Processes: 164 (NATO Science Series E:, 164)

Scientific West Process Technology for Innovative LSI/FPD Manufacturing

Electronics: Basic, Analog, and Digital with PSpice

Electromigration in Metals: Fundamentals to Nano-Interconnects

Multichip Modules with Integrated Sensors: 16 (NATO Science Partnership Subseries: 3, 16)

ISTFA 2013: Proceedings from the 39th International Symposium for Testing and Failure Analysis

Handbook of Semiconductor Manufacturing Technology

3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)

Springer 3D Microelectronic Packaging - Advanced Microelectronics

Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition: A Practical Guide to Semiconductor Processing, Sixth Edition: A ... to Semiconductor Processing (ELECTRONICS)

William Andrew Handbook of Thin Film Deposition Reference

Fundamentals of Semiconductor Processing Technology

Microelectronic Materials

Direktmontage: Handbuch über die Verarbeitung ungehäuster ICs

CRC Press Microelectronics (Electronics Handbook Series) Book

Advanced Materials for Interconnections (Volume 66) (European Materials Research Society Symposia Proceedings, Volume 66)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)

3D and Circuit Integration of MEMS

Microelectronic Materials (Graduate Student Series in Materials Science and Engineering)

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

Micro System Technologies 90: 1st International Conference on Micro Electro, Opto, Mechanic Systems and Components Berlin, 10–13 September 1990

Silicon Micromachining: 7 (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering, Series Number 7)