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£299.00
World Scientific Publishing Company Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
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Last 378 days • 378 data points (No recent data available)
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Price distribution over 378 days • 3 price levels
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Most common price: £299 (358 days, 94.7%)
Price range: £299 - £870
Price levels: 3 different prices over 378 days
Description
Product Specifications
- Format
- hardcover
- Pack Size
- 4 items
- ASIN
- 9811201110
- Domain
- Amazon UK
- Release Date
- 18 October 2019
- Listed Since
- 07 August 2019
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