Price loading...

Scientific Publishing Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-Volume Set)

Price data last checked 104 day(s) ago - refreshing...

View at Amazon

Price History & Forecast

No Price Data Available

Price history will appear here once data is collected from Amazon.

Price Distribution

No price data available for histogram

Description

Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ""learning curve,"" the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Product Specifications

Format
Hardcover
Domain
Amazon UK
Release Date
15 December 2018
Listed Since
10 April 2018

Barcode

No barcode data available

Similar Products You Might Like

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
97% match

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)

World Scientific Publishing Company

£299.00 13 Dec 2025
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
95% match

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

CRC Press

£45.07 24 Feb 2026
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
95% match

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

CRC Press

£128.50 09 Mar 2026
Thermal Stress and Strain in Microelectronics Packaging
94% match

Thermal Stress and Strain in Microelectronics Packaging

Springer

£106.26 24 Jan 2026
The Electronic Packaging Handbook (Electronics Handbook Series)
94% match

The Electronic Packaging Handbook (Electronics Handbook Series)

CRC Press

£140.75 10 Jan 2026
Advanced Thermal Design of Electronic Equipment
94% match

Advanced Thermal Design of Electronic Equipment

Springer

£147.91 15 Apr 2026
Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)
94% match

Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)

Springer

£152.53 25 Jan 2026
Wiley Thermal Management Materials for Electronic Packaging
94% match

Wiley Thermal Management Materials for Electronic Packaging

Wiley

£108.35 18 Apr 2026
Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices
94% match

Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices

ASME Press

£175.00 02 Mar 2026
Electronic Packaging Science and Technology
94% match

Electronic Packaging Science and Technology

Wiley

£124.99 02 Mar 2026
Wiley-Blackwell Advanced Electronic Packaging Book
94% match

Wiley-Blackwell Advanced Electronic Packaging Book

Wiley-Blackwell

£124.00 18 Apr 2026
Heat Transfer: Thermal Management of Electronics
94% match

Heat Transfer: Thermal Management of Electronics

CRC Press

£106.59 22 Jan 2026
William Andrew - Encapsulants for Electronic Applications
94% match

William Andrew - Encapsulants for Electronic Applications

William Andrew

£130.99 18 Apr 2026
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
94% match

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)

Woodhead Publishing

£109.11 08 Feb 2026
Encapsulation Technologies for Electronic Applications
94% match

Encapsulation Technologies for Electronic Applications

William Andrew

£163.00 09 Mar 2026
Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis
94% match

Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis

£119.99 13 Jan 2026
High Temperature Electronics (Electronic Packaging)
94% match

High Temperature Electronics (Electronic Packaging)

CRC Press

£158.50 12 Jan 2026
Encyclopedia Of Two-phase Heat Transfer And Flow Ii: Special Topics And Applications - Volume 3: Special Topics In Condensation
94% match

Encyclopedia Of Two-phase Heat Transfer And Flow Ii: Special Topics And Applications - Volume 3: Special Topics In Condensation

£179.19 11 Jan 2026
Encyclopedia Of Two-Phase Heat Transfer And Flow III: Macro And Micro Flow Boiling And Numerical Modeling Fundamentals (A 4-Volume Set)
94% match

Encyclopedia Of Two-Phase Heat Transfer And Flow III: Macro And Micro Flow Boiling And Numerical Modeling Fundamentals (A 4-Volume Set)

Scientific Publishing

£159.99 06 Jan 2026
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging
94% match

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging

Springer

£418.67 04 Feb 2026
Wiley Quality Conformance of Microelectronic Packages Book
94% match

Wiley Quality Conformance of Microelectronic Packages Book

Wiley

£121.35 13 Apr 2026
Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium (v. 2) (Thermal Management of Electronic Systems)
94% match

Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium (v. 2) (Thermal Management of Electronic Systems)

Springer

£78.46 24 Feb 2026
The Wiley Encyclopedia of Packaging Technology
93% match

The Wiley Encyclopedia of Packaging Technology

Wiley

£320.89 07 Jan 2026
The Electrical Engineering Handbook - Six Volume Set
93% match

The Electrical Engineering Handbook - Six Volume Set

CRC Press

£283.92 14 Jan 2026