We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
£128.50
CRC Press Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
Price data last checked 92 day(s) ago - refreshing...
We'll watch every seller, every day. One email when your price arrives.
About as cheap as it gets. The only time it was cheaper was 1 year ago.
£129 today · all-time low £126 (Jun 2024) · usually the usual
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 639 days • 639 data points (No recent data available)
Price Distribution
Price distribution over 639 days • 7 price levels
Price Analysis
Most common price: £129 (529 days, 82.8%)
Price range: £126 - £170
Price levels: 7 different prices over 639 days
Description
Product Specifications
- Brand
- CRC Press
- Format
- hardcover
- ASIN
- 1498753957
- Domain
- Amazon UK
- Release Date
- 06 July 2016
- Listed Since
- 07 December 2015
Barcode
No barcode data available
Similar Products You Might Like
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
CRC Press
Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis
Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-Volume Set)
Scientific Publishing
Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)
Springer
Wiley Thermal Management Materials for Electronic Packaging
Wiley
Thermal Stress and Strain in Microelectronics Packaging
Springer
Heat Transfer: Thermal Management of Electronics
CRC Press
The Electronic Packaging Handbook (Electronics Handbook Series)
CRC Press
Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices
ASME Press
Thermal Design of Electronic Equipment (Electronics Handbook Series)
CRC Press
Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
Springer
Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
Springer
Advanced Thermal Design of Electronic Equipment
Springer
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
World Scientific Publishing Company
Design for Excellence in Electronics Manufacturing (Quality and Reliability Engineering Series)
Wiley
Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems: 4 (Quality and Reliability Engineering Series)
Wiley
Principles of Microelectromechanical Systems (IEEE Press)
Wiley
CRC Press Electronic Packaging Materials and Their Properties
CRC Press
Air Cooling Technology for Electronic Equipment
CRC Press
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Woodhead Publishing
Extreme Environment Electronics (Industrial Electronics)
CRC Press
Microscale and Nanoscale Heat Transfer: Analysis, Design, and Application
CRC Press
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Springer
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
Springer