We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
£108.35
Wiley Thermal Management Materials for Electronic Packaging
Price data last checked 8 day(s) ago - will refresh soon
Price History & Forecast
Last 83 days • 83 data points (No recent data available)
Price Distribution
Price distribution over 83 days • 1 price levels
Price Analysis
Most common price: £108 (83 days, 100.0%)
Price range: £108 - £108
Price levels: 1 different prices over 83 days
Description
Key Features
Explores the theoretical and experimental basis for developing new thermal management materials for electronic packaging.
Provides systematic summaries of cutting-edge materials designed for high-power density electronic devices.
Introduces various preparation methods used in the creation of thermal management materials.
Covers specific application scenarios and refinements for electronic packaging thermal processes.
Offers in-depth insights into the characterization of materials used in modern electronic cooling.
Product Specifications
- Brand
- Wiley
- Format
- hardcover
- ASIN
- 3527352422
- Domain
- Amazon UK
- Release Date
- 17 January 2024
- Listed Since
- 26 September 2022
Barcode
No barcode data available
Similar Products You Might Like
Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)
Springer
Polymeric Materials for Electronic Packaging
Wiley-IEEE Press
Electronic Packaging Science and Technology
Wiley
Wiley-Blackwell Advanced Electronic Packaging Book
Wiley-Blackwell
Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-Volume Set)
Scientific Publishing
Wiley High Temperature Polymer Dielectrics - Power Equipment
Wiley
CRC Press Electronic Packaging Materials and Their Properties
CRC Press
High Temperature Electronics (Electronic Packaging)
CRC Press
Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices
ASME Press
Packaging Technology and Engineering: Pharmaceutical, Medical and Food Applications
Wiley
Thermal Stress and Strain in Microelectronics Packaging
Springer
Heat Transfer: Thermal Management of Electronics
CRC Press
High Temperature Electronics
CRC Press
Wiley Electronic Materials Science - Advanced Science Textbook
Wiley
Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-Attach And Wafer Bonding Technology (A 4-Volume Set)
World Scientific Publishing Company
Advanced Thermal Design of Electronic Equipment
Springer
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Wiley
William Andrew - Electrical Conductivity in Polymer Composites
William Andrew
Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium (v. 2) (Thermal Management of Electronic Systems)
Springer
Wiley Quality Conformance of Microelectronic Packages Book
Wiley
Flexible Thermoelectric Polymers and Systems
Wiley
Wiley Fundamentals of Electroceramics - Materials and Devices
Wiley
Materials, Preparation, and Characterization in Thermoelectrics: Thermoelectrics and Its Energy Harvesting
CRC Press
Reliability and Failure of Electronic Materials and Devices
Academic Press