£108.35

Wiley Thermal Management Materials for Electronic Packaging

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Description

Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices serves as a practical resource for professionals and researchers. This text explores both the theoretical and experimental foundations required to develop new thermal management materials specifically for electronic packaging applications. As high-power density electronic devices become more common, managing heat is a primary challenge. This book provides systematic summaries of cutting-edge materials designed to address these thermal needs. It introduces various preparation methods and discusses specific application scenarios for electronic packaging, covering the refinements of thermal processes. By providing in-depth knowledge on material preparation and characterization, this Wiley-VCH publication helps readers understand how to implement effective solutions for modern electronic device cooling and stability. It is an essential guide for those working with high-power density electronics and advanced material science.

Key Features

Explores the theoretical and experimental basis for developing new thermal management materials for electronic packaging.

Provides systematic summaries of cutting-edge materials designed for high-power density electronic devices.

Introduces various preparation methods used in the creation of thermal management materials.

Covers specific application scenarios and refinements for electronic packaging thermal processes.

Offers in-depth insights into the characterization of materials used in modern electronic cooling.

Product Specifications

Brand
Wiley
Format
hardcover
Domain
Amazon UK
Release Date
17 January 2024
Listed Since
26 September 2022

Barcode

No barcode data available

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