£45.07

CRC Press Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

Price data last checked 60 day(s) ago - refreshing...

View at Amazon

Price History & Forecast

Last 31 days • 31 data points (No recent data available)

Historical
Generating forecast...
£45.53 £26.17 £30.39 £34.62 £38.84 £43.07 £47.29 25 January 2026 01 February 2026 09 February 2026 16 February 2026 24 February 2026

Price Distribution

Price distribution over 31 days • 5 price levels

Days at Price
Current Price
3 days 17 days 4 days 3 days · current 4 days 0 4 9 13 17 £28 £34 £41 £45 £46 Days at Price

Price Analysis

Most common price: £34 (17 days, 54.8%)

Price range: £28 - £46

Price levels: 5 different prices over 31 days

Description

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
30 June 2021
Listed Since
10 April 2021

Barcode

No barcode data available

Similar Products You Might Like

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
99% match

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition

CRC Press

£128.50 09 Mar 2026
Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis
97% match

Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis

£119.99 13 Jan 2026
The Electronic Packaging Handbook (Electronics Handbook Series)
95% match

The Electronic Packaging Handbook (Electronics Handbook Series)

CRC Press

£140.75 10 Jan 2026
Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-Volume Set)
95% match

Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-Volume Set)

Scientific Publishing

£493.32 11 Jan 2026
Heat Transfer: Thermal Management of Electronics
94% match

Heat Transfer: Thermal Management of Electronics

CRC Press

£106.59 22 Jan 2026
Advanced Thermal Design of Electronic Equipment
94% match

Advanced Thermal Design of Electronic Equipment

Springer

£147.91 15 Apr 2026
Electronic Components and Technology (Tutorial Guides in Electronic Engineering)
94% match

Electronic Components and Technology (Tutorial Guides in Electronic Engineering)

CRC Press

£32.71 05 Mar 2026
Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices
94% match

Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices

ASME Press

£175.00 02 Mar 2026
Thermal Stress and Strain in Microelectronics Packaging
94% match

Thermal Stress and Strain in Microelectronics Packaging

Springer

£106.26 24 Jan 2026
Electronic Components and Technology (Tutorial Guides in Electronic Engineering)
94% match

Electronic Components and Technology (Tutorial Guides in Electronic Engineering)

CRC Press

£165.85 10 Jan 2026
High Temperature Electronics (Electronic Packaging)
94% match

High Temperature Electronics (Electronic Packaging)

CRC Press

£158.50 12 Jan 2026
Air Cooling Technology for Electronic Equipment
94% match

Air Cooling Technology for Electronic Equipment

CRC Press

£57.03 19 Feb 2026
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
94% match

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Wiley

£141.39 08 Mar 2026
Wiley Quality Conformance of Microelectronic Packages Book
94% match

Wiley Quality Conformance of Microelectronic Packages Book

Wiley

£121.35 13 Apr 2026
Mechanical Design of Electronic Systems
94% match

Mechanical Design of Electronic Systems

College House Enterprises, LLC

£105.00 23 Feb 2026
CRC Press Electronic Packaging Materials and Their Properties
93% match

CRC Press Electronic Packaging Materials and Their Properties

CRC Press

£101.16 14 Apr 2026
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
93% match

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)

Woodhead Publishing

£109.11 08 Feb 2026
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
93% match

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)

CRC Press

£65.59 27 Feb 2026
Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)
93% match

Advanced Materials for Thermal Management of Electronic Packaging: 30 (Springer Series in Advanced Microelectronics, 30)

Springer

£152.53 25 Jan 2026
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
93% match

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Springer

£199.99 09 Feb 2026
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
93% match

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Springer

£179.27 24 Jan 2026
Food Packaging: Principles and Practice, Third Edition
93% match

Food Packaging: Principles and Practice, Third Edition

CRC Press

£112.43 07 Apr 2026
Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)
93% match

Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)

CRC Press

£50.56 28 Feb 2026
High Temperature Electronics
93% match

High Temperature Electronics

CRC Press

£64.29 14 Apr 2026