Woodhead Publishing Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Review Provides an overview of modeling and analysis techniques for predicting and evaluating electrical, thermal and mechanical performance in 2.5 and 3D packaging From the Back Cover Modeling, analysis, design, and test  for electronics packaging beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and test for 2.5D/3D and interconnects to the system integration and testing. The book addresses important topics including electrically and thermally induced issues such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. Not only are the basic principles in electrical, thermal and mechanical areas presented in detail, but also practical design and test techniques for packages and systems such as  2.5D/3D packages. On-package thermal and mechanical management systems  are involved and discussed. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging. Features experimental characterization and qualifications for analysis and verification of electronic packaging design. Provides multiphysics modeling and analysis techniques of electronic packaging. This book is a valuable resource for design engineers, processing engineers, and application engineers as well as for graduate students in electronics packaging areas. About the Author Dr. Hengyun Zhang is a professor in Shanghai University of Engineering Science. He has worked in industry and research institutes for 16 years, including Institute of Microelectronics (Singapore), Advanced Micro Devices and Dow Corning. He was the recipient of the Best Poster Paper award from ITHERM 2004, AMD Engineering Excellence Award 2008, and Best Paper award from Icept 2010. He has nearly 70 publications in international journals and conferences, and more than 24 patents granted/filed of thermal and packaging significance. He also served in a number of international conferences as a committee member (ITHERM, ICEPT, EPTC, MNHMT etc). He was a speaker in IME Industry Forums on thermal packaging and the project leader for more than ten research projects. His current interests include thermal management and electronics packaging. Dr. Faxing Che is a scientist with the Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-star), Singapore. He has 13-years’ experience in the design-for-reliability for advanced electronics packaging. He was a Senior R&D Engineer with the United Test and Assembly Centre and ST Microelectronics for three years, and a Staff Engineer with Infineon Technologies Singapore for two years. He has authored and co-authored more than 120 technical papers in refereed journals and conferences. His current research interests include design for reliability in wafer-level, chip scale packaging, and 3-D advanced packaging, Cu wire bonding, Fan-out WLP, finite-element modeling and characterization of microelectronics packaging materials. Dr. Tingyu Lin is a technical Director of National Centre for Advanced Packaging (NCAP), China. He has more than 20-year experiences in design, process, assembly, reliability and equipment development in electronics packaging, semiconductor, consumer ele