£196.02

Frontal Semiconductor Research

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Last 639 days • 639 data points (No recent data available)

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£196.02 £127.90 £142.76 £157.62 £172.49 £187.35 £202.21 09 June 2024 15 November 2024 24 April 2025 30 September 2025 09 March 2026

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23 days 102 days 4 days 18 days 130 days 20 days 51 days 23 days 267 days 1 day · current 0 67 134 200 267 £134 £135 £138 £139 £140 £143 £144 £145 £146 £196 Days at Price

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Most common price: £146 (267 days, 41.8%)

Price range: £134 - £196

Price levels: 10 different prices over 639 days

Description

This book includes within its scope studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctions; all multi-layered structures involving semiconductor components. Dopant incorporation. Growth and preparation of materials, including both epitaxial (e.g. molecular beam and chemical vapour methods) and bulk techniques; in situ monitoring of epitaxial growth processes, also included are appropriate aspects of surface science such as the influence of growth kinetics and chemical processing on layer and device properties. The physics of semiconductor electronic and optoelectronic devices are examined , including theoretical modelling and experimental demonstration; all aspects of the technology of semiconductor device and circuit fabrication. Relevant areas of 'molecular electronics' and semiconductor structures incorporating Langmuir- Blodgett films; resists, lithography and metallisation where they are concerned with the definition of small geometry structure. The structural, electrical and optical characterisation of materials and device structures are also included. The scope encompasses materials and device reliability: reliability evaluation of technologies; failure analysis and advanced analysis techniques such as SEM, E-beam, optical emission microscopy, acoustic microscopy techniques; liquid crystal techniques; noise measurement, reliability prediction and simulation; reliability indicators; failure mechanisms, including charge migration, trapping, oxide breakdown, hot carrier effects, electro-migration, stress migration; package- related failure mechanisms; effects of operational and environmental stresses on reliability.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
19 November 2006
Listed Since
08 January 2007

Barcode

No barcode data available

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