Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging) - Image 1

£50.56

CRC Press Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)

Name: Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)
Brand: CRC Press
Price: 50.56 GBP
Availability: InStock

Civil Engineering

This is the usual price. Wait for it to drop, or tell us your number.

£51 today · usual range £0–£0 · best ever £28

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 630 days • 630 data points (No recent data available)

Historical

Generating forecast...

Price Distribution

Price distribution over 630 days • 8 price levels

Days at Price

Current Price

Price Analysis

Most common price: £45 (242 days, 38.4%)

Price range: £28 - £105

Price levels: 8 different prices over 630 days

Description

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Product Specifications

Brand: CRC Press
Format: Hardcover
ASIN: 0849396247
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Civil Engineering
Domain: Amazon UK
Release Date: 29 December 1998
Listed Since: 05 February 2007

Barcode

No barcode data available

CRC Press Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)

This is the usual price. Wait for it to drop, or tell us your number.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Reliability and Failure of Electronic Materials and Devices

Failure Mechanisms in Semiconductor Devices

Reliability and Failure of Electronic Materials and Devices

Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems: 4 (Quality and Reliability Engineering Series)

Reliability Prediction for Microelectronics (Quality and Reliability Engineering Series)

Integrated Circuit Failure Analysis: A Guide to Preparation Techniques (Quality and Reliability Engineering Series)

Semiconductor Process Reliability in Practice (ELECTRONICS)

Reliability and Failure of Electronic Materials and Devices

Semiconductor Packaging: Materials Interaction and Reliability

Semiconductor Packaging: Materials Interaction and Reliability

Proceedings of the 13th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis: Proceedings of the 13th European ... (ESREF 2002) Rimini, Italy 7-11 October 2002

Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Reliability Wearout Mechanisms in Advanced CMOS Technologies (IEEE Press Series on Microelectronic Systems)

Semiconductor Device Reliability: 175 (NATO Science Series E:, 175)

Integrated Circuit Quality and Reliability (Electrical and Computer Engineering)

Wiley Quality Conformance of Microelectronic Packages Book

Reliability of Electronic Components: A Practical Guide to Electronic Systems Manufacturing

Hot-Carrier Reliability of MOS VLSI Circuits: 227 (The Springer International Series in Engineering and Computer Science, 227)

Interfacial Compatibility in Microelectronics: Moving Away from the Trial and Error Approach (Microsystems)

3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics, 57)

Component Reliability for Electronic Systems (Artech House Remote Sensing Library)

Design for Excellence in Electronics Manufacturing (Quality and Reliability Engineering Series)

Hot-Carrier Reliability of MOS VLSI Circuits: 227 (The Springer International Series in Engineering and Computer Science, 227)

Failure Modes and Mechanisms in Electronic Packages