Springer Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product. Review From the reviews: "The book contains 25 chapters written by experts, mainly drawn from the United States and Europe. The chapters contain good technical details and thorough reference lists, and most of the figures are high quality. … For those engaged in developing MOEMS products and similar activities, the acquisition of this book … will be a sound investment." (K. Alan Shore, Optics and Photonics News, November, 2007) From the Back Cover Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices.   Furthermore,  practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices.  The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book. Topics addressed in the book include, but are not limited to, the following: physics and mechanics of polymer materials; underfills; electrically conductive adhesives; plastic packages of IC devices; flip-chip packages; wirebond interconnects and metallurgical interconnections for harsh environments; reliability and stress testing and accelerated life testing; solder joint materials and technologies as well as  lead-free solder materials and joints; reliability of mobile electronic products,  photonic materials, optical fibers and active and passive optical components; thermal phenomena in micro- and opto-electronic systems and thermal stresses; adhesion problems and solutions; thin film materials, physics and mechanics; photorefractive materials and devices; nanomaterials and nanotechnology;   multiphysics modeling and optimization technologies; experimental methods and techniques;  testing methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others. The book is intended  as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems. About the Author Dr. Ephraim Suhir is Distinguished Member of Technical Staff (retired), Basic Research,