Woodhead Publishing Reliability and Failure Analysis of High-Power LED Packaging (Woodhead Publishing Series in Electronic and Optical Materials)

Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide new insights for readers regarding the different possible failure mechanisms in high power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to a harsher stress conditions that high-power LEDs have to face. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Review Introduction to the fundamental concepts of failure and reliability mechanisms of high-power LED packaging under varying environmental conditions From the Back Cover Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide new insights for readers regarding the different possible failure mechanisms in high power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to a harsher stress conditions that high-power LEDs have to face. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. About the Author Prof Tan received his Ph.D in Electrical Engineering from the University of Toronto in 1992. He has 8 years of working experience in reliability in the electronics industry (both Singapore and Taiwan) before joining Nanyang Technological University (NTU) as a faculty member in 1996 where he stayed until 2014. He is now a Professor at Chang Gung University, Taiwan and the Director of the Centre of Reliability Science and Technology. He has published more than 350 International Journal and Conference papers and holds 10 patents and 1 copyright for reliability software. He has given more than 50 keynote and invited talks at International Conferences. He has written 5 books and 4 book chapters in the field of reliability. He is the Series Editor of Springer Briefs in Reliability, Editor of Scientific Reports, Editor of IEEE Transactions on Materials and Device Reliability, Associate Editor of Microelectronics Reliability, and Research Editor of Frontiers in Materials. He is Fell