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£87.46
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£87 today · cheaper than every other day in the last 3 months
Springer Semiconductor Advanced Packaging Engineering Book
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Last 33 days · 33 data points (no recent data)
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Price distribution over 33 days • 2 price levels
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Most common price: £89 (22 days, 66.7%)
Price range: £88 - £89
Price levels: 2 different prices over 33 days
Description
Key Features
This Springer publication covers the design, materials, process, fabrication, and reliability of advanced semiconductor packaging systems.
The text provides an in-depth study of system-in-package and fan-in or fan-out wafer/panel-level chip-scale packages.
Learn about diverse IC integration methods including 2D, 2.1D, 2.3D, 2.5D, and 3D integration techniques.
Detailed technical content covers chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, and hybrid bonding.
The book addresses the use of dielectric materials for high speed semiconductor applications and engineering practice.
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 9811613788
- Domain
- Amazon UK
- Release Date
- 19 May 2022
- Listed Since
- 21 April 2022
Barcode
No barcode data available
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