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£120.05
About as cheap as it gets — within 5% of the all-time low it hit 2 months ago.
£120 today · all-time low £118 (Sep 2026) · usually £120
Springer Flip Chip and Hybrid Bonding Technology Book
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Last 87 days · 87 data points (no recent data)
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Price Distribution
Price distribution over 87 days • 3 price levels
Price Analysis
Most common price: £120 (51 days, 58.6%)
Price range: £118 - £122
Price levels: 3 different prices over 87 days
Description
Key Features
Covers essential semiconductor topics including flip chip, hybrid bonding, fan-in, and fan-out technology.
Focuses on engineering practice regarding wafer bumping, flip chip assembly, and underfill reliability.
Provides detailed study on Cu-Cu hybrid bonding and various chip-to-wafer or wafer-to-wafer processes.
Explores advanced WLCSP and 6-side molded WLCSP manufacturing methods.
Includes technical information on FOWLP, hybrid substrates with PID, ABF, and ultra-large organic interposers.
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 9819721393
- Category
- Books > Subjects > Science, Nature & Maths > Engineering & Technology > Engineering Physics
- Domain
- Amazon UK
- Release Date
- 24 May 2024
- Listed Since
- 23 February 2024
Barcode
No barcode data available
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