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Wiley Semiconductor Wafer Bonding: Science and Technology 33

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Description

Semiconductor Wafer Bonding: Science and Technology serves as a comprehensive resource for materials scientists and electrical engineers. Part of the ECS Series of Texts and Monographs, this volume addresses the full spectrum of mainstream and future applications in wafer bonding technology. The text examines fundamental issues including basic interactions between flat surfaces and the specific influence of particles, surface steps, and cavities. Readers gain insights into surface preparation, room-temperature wafer bonding, and the thermal treatment of bonded wafer pairs. This Wiley-Interscience publication consolidates essential information into a single resource, making it an effective tool for understanding the technical requirements and scientific principles behind semiconductor wafer bonding processes.

Key Features

This Wiley publication provides a complete resource on all aspects of semiconductor wafer bonding for electrical engineers.

The text covers the entire spectrum of mainstream and future applications within the field of wafer bonding.

Detailed technical discussions include the influence of particles, surface steps, and cavities on bonding processes.

The book examines critical topics such as surface preparation and room-temperature wafer bonding techniques.

Information is provided regarding the thermal treatment of bonded wafer pairs for materials scientists.

Product Specifications

Brand
Wiley
Format
hardcover
Domain
Amazon UK
Release Date
18 December 1998
Listed Since
09 February 2007

Barcode

No barcode data available

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