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Academic Press Chemical Mechanical Polishing in Silicon Processing - Volume 63

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Description

Chemical Mechanical Polishing in Silicon Processing is the 63rd volume in the renowned Semiconductors and Semimetals series published by Academic Press. Since 1966, this distinguished series has established itself as a definitive resource through contributions from leading experts and editors in semiconductor research and development. This volume continues the tradition of delivering landmark content that remains highly cited years after publication, offering comprehensive insights into chemical mechanical polishing techniques essential to modern silicon processing. With Professor Eicke R. Weber of the University of California at Berkeley serving as co-editor, this volume represents the latest advancement in the field's technical knowledge and practical applications for semiconductor manufacturing professionals and researchers.

Key Features

Volume 63 in the prestigious Semiconductors and Semimetals series, maintaining decades of excellence in semiconductor literature since 1966.

Features contributions from well-known authors and editors specializing in chemical mechanical polishing and silicon processing technologies.

Landmark content with proven citation impact, remaining relevant and referenced years after initial publication.

Co-edited by Professor Eicke R. Weber from the University of California at Berkeley, ensuring current expertise in semiconductor processing.

Comprehensive coverage of chemical mechanical polishing techniques essential for modern silicon semiconductor manufacturing.

Published by Academic Press, a trusted source for engineering and technology reference materials.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
24 August 2011
Listed Since
13 September 2011

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