£150.00

Springer Wafer Bonding: Applications and Technology - Vol 75

Name: Springer Wafer Bonding: Applications and Technology - Vol 75
Brand: Springer
Price: 150.0 GBP
Availability: InStock

Civil Engineering

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Description

Explore the evolving landscape of semiconductor fabrication with Wafer Bonding: Applications and Technology, part of the Springer Series in Materials Science (Volume 75). This comprehensive text covers essential bonding-based fabrication methods used in modern electronics, including silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, and MEMS. It also examines hybrid integration and laser lift-off techniques. Designed to serve a wide audience, this book provides the fundamental basics of wafer bonding for non-specialists. For researchers and industry professionals, it offers up-to-date information on this rapidly advancing field, including relevant patent information. As wafer bonding has grown from a niche technology into a vital part of modern manufacturing, this volume serves as a necessary resource for staying current with industry standards and new developments.

Key Features

Covers essential fabrication methods such as silicon-on-insulator, photonic crystals, and VCSELs.

Provides technical details on SiGe-based FETs, MEMS, and hybrid integration processes.

Includes information on laser lift-off technology for advanced applications.

Offers foundational knowledge of wafer bonding basics suitable for non-specialists.

Delivers up-to-date research data and relevant patent information for professionals.

Serves as a key resource in the Springer Series in Materials Science, Volume 75.

Product Specifications

Brand: Springer
Format: paperback
ASIN: 3642059155
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Civil Engineering
Domain: Amazon UK
Release Date: 30 September 2011
Listed Since: 01 October 2010

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Springer Wafer Bonding: Applications and Technology - Vol 75

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