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£151.20
About as cheap as it gets — within 5% of the all-time low it hit 3 months ago.
£151 today · all-time low £145 (Jul 2026) · usually the usual
Springer Wafer Bonding: Applications and Technology - Springer Series 75
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Last 51 days · 51 data points (no recent data)
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Price Distribution
Price distribution over 51 days • 4 price levels
Price Analysis
Most common price: £148 (22 days, 43.1%)
Price range: £145 - £240
Price levels: 4 different prices over 51 days
Description
Key Features
Covers direct wafer bonding as a mature materials integration technology with expert contributions from industry and academic specialists.
Includes detailed coverage of silicon-on-insulator, photonic crystals, VCSELs and SiGe-based FETs fabrication using wafer bonding methods.
Addresses MEMS development, hybrid integration approaches, and laser lift-off technology applications in wafer bonding processes.
Part of the Springer Series in Materials Science (volume 75), providing peer-reviewed content for engineering and technology professionals.
Serves both introductory learners mastering wafer bonding basics and researchers seeking current information on advanced applications.
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 3642059155
- Domain
- Amazon UK
- Release Date
- 30 September 2011
- Listed Since
- 01 October 2010
Barcode
No barcode data available
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