Springer Wafer Bonding: Applications and Technology - Vol 75

Explore the evolving landscape of semiconductor fabrication with Wafer Bonding: Applications and Technology, part of the Springer Series in Materials Science (Volume 75). This comprehensive text covers essential bonding-based fabrication methods used in modern electronics, including silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, and MEMS. It also examines hybrid integration and laser lift-off techniques. Designed to serve a wide audience, this book provides the fundamental basics of wafer bonding for non-specialists. For researchers and industry professionals, it offers up-to-date information on this rapidly advancing field, including relevant patent information. As wafer bonding has grown from a niche technology into a vital part of modern manufacturing, this volume serves as a necessary resource for staying current with industry standards and new developments.