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£87.39
Scientific Publishing MEMS Packaging - WSPC Series Book
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Description
Key Features
Covers the role of MEMS sensors and actuators in modern smartphone, AR/VR, and wearable electronic devices.
Explains how to protect moving MEMS devices throughout the manufacturing and operation stages.
Provides technical insights into wafer level capping and encapsulation processes for improved device reliability.
Details 3D packaging applications used to connect MEMS devices with electronic chips.
Focuses on methods to minimize the physical footprint during device integration.
Product Specifications
- Brand
- Scientific Publishing
- Format
- hardcover
- ASIN
- 9813229357
- Domain
- Amazon UK
- Release Date
- 28 February 2018
- Listed Since
- 11 July 2017
Barcode
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