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£87.73
Scientific Publishing MEMS Packaging: Advanced Integration & Encapsulation Guide
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Last 87 days · 87 data points (no recent data)
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Price distribution over 87 days • 3 price levels
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Most common price: £88 (30 days, 34.5%)
Price range: £86 - £88
Price levels: 3 different prices over 87 days
Description
Key Features
MEMS Packaging covers wafer level capping and encapsulation processes that protect moving MEMS devices throughout manufacturing and field operation.
The book addresses 3D packaging integration methods for connecting MEMS devices with electronic chips whilst maintaining the smallest possible footprint.
Designed for engineers working with MEMS sensors and actuators in smartphones, AR/VR headsets, and wearable electronics applications.
Part of the WSPC Series in Advanced Integration and Packaging, providing advanced technical knowledge from World Scientific Publishing Company.
Comprehensive treatment of MEMS packaging challenges and solutions for reliable micro-electromechanical system design and manufacture.
Product Specifications
- Brand
- Scientific Publishing
- Format
- hardcover
- ASIN
- 9813229357
- Domain
- Amazon UK
- Release Date
- 28 February 2018
- Listed Since
- 11 July 2017
Barcode
No barcode data available
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