Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing) - Image 1

£43.87

Springer Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)

Name: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)
Brand: Springer
Price: 43.87 GBP
Availability: InStock

Mechanics

It has never been this cheap. We have no record of a lower price.

£44 today · cheaper than every other day in the last 3 months

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 34 days • 34 data points (No recent data available)

Historical

Generating forecast...

Price Distribution

Price distribution over 34 days • 1 price levels

Days at Price

Price Analysis

Most common price: £44 (34 days, 100.0%)

Price range: £44 - £44

Price levels: 1 different prices over 34 days

Description

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. From the Back Cover This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Product Specifications

Brand: Springer
Format: hardcover
ASIN: 3319778714
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Civil Engineering > Mechanics
Domain: Amazon UK
Release Date: 14 May 2018
Listed Since: 14 February 2018

Barcode

No barcode data available

Springer Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)

It has never been this cheap. We have no record of a lower price.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Coupled Multiscale Simulation and Optimization in Nanoelectronics: 21 (Mathematics in Industry, 21)

Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators (NATO Science for Peace and Security Series B: Physics and Biophysics)

Smart Material Systems and MEMS: Design and Development Methodologies

Principles of Microelectromechanical Systems (IEEE Press)

Advanced Materials: Manufacturing, Physics, Mechanics and Applications: 175 (Springer Proceedings in Physics, 175)

Physics and Mechanics of New Materials and Their Applications: Proceedings of the International Conference PHENMA 2020: 10 (Springer Proceedings in Materials, 10)

Microactuators and Micromechanisms: Proceedings of MAMM 2014, Timisoara, Romania, October 2-4, 2014: 30 (Mechanisms and Machine Science, 30)

Submicron Porous Materials

Sonochemistry: From Basic Principles to Innovative Applications (Topics in Current Chemistry Collections)

Metamaterial Surface Plasmon-Based Transmission Lines and Antennas (Springer Theses)

Generation and Parametric Amplification of Few‐Cycle Light Pulses at Relativistic Intensities (Springer Theses)

Sonochemistry: From Basic Principles to Innovative Applications (Topics in Current Chemistry Collections)

Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)

Sensors and Microsystems: Proceedings of the 20th AISEM 2019 National Conference: 629 (Lecture Notes in Electrical Engineering, 629)

Optofluidics, Sensors and Actuators in Microstructured Optical Fibres

Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)

Sustainability for 3D Printing (Springer Tracts in Additive Manufacturing)

Modelling of Plasmonic and Graphene Nanodevices (Springer Theses)

Bio-inspired Asymmetric Design and Building of Biomimetic Smart Single Nanochannels (Springer Theses)

Applications in Electronics Pervading Industry, Environment and Society: APPLEPIES 2020: 738 (Lecture Notes in Electrical Engineering, 738)

Guanine Quartets: Structure and Application

Black Phosphorus: Synthesis, Properties and Applications (Engineering Materials)

Molecular-Scale Electronics: Current Status and Perspectives (Topics in Current Chemistry Collections)

Selected Advances in Nanoelectronic Devices: Logic, Memory and RF: 175 (Lecture Notes in Electrical Engineering, 175)