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CRC Press Introduction to Microsystem Packaging Technology - CRC Press

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£127.30 £111.82 £115.20 £118.58 £121.95 £125.33 £128.71 25 July 2026 12 August 2026 30 August 2026 17 September 2026 06 October 2026
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41 days 31 days 2 days · current 0 10 21 31 41 £113 £114 £127 Days at Price

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Most common price: £113 (41 days, 55.4%)

Price range: £113 - £127

Price levels: 3 different prices over 74 days

Description

Introduction to Microsystem Packaging Technology by CRC Press explores the essential techniques and innovations shaping the multi-billion-dollar microsystem packaging industry. This comprehensive guide covers design and manufacturing technologies that form the technical foundation for integrating function chips into modern application systems. The book addresses critical areas including microelectronics, optoelectronics, RF and wireless technologies, and MEMS, providing engineers and technology professionals with in-depth knowledge of packaging processes that directly impact the performance, reliability and market competitiveness of information systems. Ideal for professionals seeking to understand how packaging innovations drive technical advancement and value creation across the electronics and telecommunications sectors.

Key Features

Introduction to Microsystem Packaging Technology covers the core design and manufacturing technologies essential to modern microelectronics packaging.

This CRC Press publication addresses microelectronics, optoelectronics, RF and wireless technologies within a single authoritative resource.

The book explains how packaging processes serve as the technical foundation for integrating function chips into application systems.

Designed for engineers and technology professionals working in the information industry and related electrical engineering disciplines.

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