£106.95

Springer Heterogeneous Integrations

Name: Heterogeneous Integrations
Brand: Springer
Price: 106.95 GBP
Availability: InStock

Circuits

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Description

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Product Specifications

Brand: Springer
Format: hardcover
ASIN: 9811372233
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering > Circuits
Domain: Amazon UK
Release Date: 12 April 2019
Listed Since: 15 February 2019

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Springer Heterogeneous Integrations

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