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£46.88
Springer CMP of Low Dielectric Constant Polymers and OSG Book
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Description
Key Features
Provides a deep look into the fundamental mechanisms of chemical-mechanical polishing for low-dielectric constant polymers and organosilicate glasses.
Addresses the specific challenges of using low-kappa insulators as replacements for silicon dioxide in semiconductor manufacturing.
Explores how material properties affect the chemical-mechanical planarization (CMP) process used in Damascene patterning.
Supports research into maximizing the advantages of copper interconnects, including faster signal propagation and lower power consumption.
Offers technical insights into the behavior of softer, less chemically reactive materials during the integration of advanced interconnect schemes.
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 1402071930
- Domain
- Amazon UK
- Release Date
- 30 September 2002
- Listed Since
- 26 January 2007
Barcode
No barcode data available
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