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Springer Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)

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Description

Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.

Product Specifications

Format
Paperback
Domain
Amazon UK
Release Date
01 December 2010
Listed Since
05 September 2010

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