Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69) - Image 1

£153.84

Springer Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)

Name: Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)
Brand: Springer
Price: 146.45 GBP
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Physical Chemistry

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Description

Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.

Product Specifications

Brand: Springer
Format: Paperback
ASIN: 3642077382
Category: Books > Subjects > Science, Nature & Maths > Chemistry > Physical Chemistry
Domain: Amazon UK
Release Date: 01 December 2010
Listed Since: 05 September 2010

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Springer Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)

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