Springer Copper Interconnect Technology - Engineering Book

Explore the transition from transistor-focused design to the modern era of interconnection importance. As circuit performance shifts away from being solely dependent on transistor properties, understanding the role of parasitic resistance, capacitance, and inductance becomes necessary for advancing nanoscale ULSI technology. This technical resource by Springer examines why metallic conductivity and resistance to electromigration in bulk copper (Cu) provide superior performance compared to traditional aluminum. It covers the widespread international use of copper and low-k materials in current microelectronics. For engineers and researchers working in nanotechnology and electrical engineering, this text provides a necessary look at the factors influencing the evolution of modern integrated circuits.