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£105.24
Springer Copper Interconnect Technology - Engineering Book
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Description
Key Features
Analyzes how parasitic resistance, capacitance, and inductance influence modern circuit performance and speed.
Compares the metallic conductivity and electromigration resistance of copper against traditional aluminum materials.
Provides technical insights into the evolution of nanoscale ULSI technology and microelectronics.
Discusses the prevalence of copper and low-k materials used in international microelectronics manufacturing.
Addresses the shift in focus from transistor properties to interconnection performance in circuit design.
Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 1441900756
- Category
- Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electrical > Nanotechnology
- Domain
- Amazon UK
- Release Date
- 07 August 2009
- Listed Since
- 30 January 2009
Barcode
No barcode data available
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