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Springer Copper Interconnect Technology - Springer Engineering Book

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Description

Copper Interconnect Technology by Springer explores the critical role of metallic interconnections in modern circuit design and nanoscale ULSI systems. As transistor optimisation alone reaches its limits, this comprehensive resource examines how parasitic resistance, capacitance, and inductance in interconnections now dictate overall circuit performance. The book details why copper and low-k materials have become the industry standard, leveraging copper's superior metallic conductivity and exceptional resistance to electromigration compared to traditional aluminium. Essential reading for electrical engineers, nanotechnology specialists, and semiconductor professionals seeking to understand the fundamental physics and engineering principles governing high-speed circuit interconnects in next-generation microelectronic systems.

Key Features

Focuses on copper interconnect technology as a primary factor in nanoscale ULSI circuit evolution and performance optimisation.

Examines parasitic resistance, capacitance, and inductance effects that influence modern circuit speed and system reliability.

Compares copper's superior metallic conductivity and electromigration resistance against traditional aluminium interconnect materials.

Published by Springer in the Engineering and Technology nanotechnology subject category for academic and professional audiences.

Covers low-k material integration strategies alongside copper interconnects for advanced semiconductor manufacturing.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
07 August 2009
Listed Since
30 January 2009

Barcode

No barcode data available

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