£107.43

Springer Copper Interconnect Technology - Microelectronics Book

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Description

Master the complexities of modern microelectronics with Copper Interconnect Technology by Springer. This specialized text provides a deep look into the advanced systems required for high-performance semiconductor manufacturing. As technology evolves, addressing the challenges of Cu-interconnect technology becomes a necessity for researchers and engineers working in nanotechnology. This book covers essential topics including advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches. It is designed to help professionals navigate the specific technical hurdles found in current interconnection line development. By combining materials science, technology, and practical applications, this resource serves as a comprehensive guide for the microelectronics research community. Whether you are studying mathematical modeling or exploring new photolithography materials, this text provides the data and methods needed to advance your work in the field.

Key Features

Explores advanced laser systems using lower radiation wavelengths to address modern microelectronics challenges.

Provides detailed information on photolithography materials used in high-tech interconnect processes.

Includes mathematical modeling approaches to solve complex issues in Cu-interconnect technology.

Combines materials science and technology to support the needs of microelectronics researchers.

Contains extensive graphs, data, and properties to assist with technical research and applications.

Offers practical methods and data-driven insights for studying interconnection lines.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
29 November 2014
Listed Since
02 December 2014

Barcode

No barcode data available

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