We can't find the internet
Attempting to reconnect
Something went wrong
Hang in there while we get back on track
£113.76
This is the most expensive it has ever been. Walk away.
£114 today · previous high £114 · all-time low £108
Springer Copper Interconnect Technology - Springer Engineering Book
We'll watch every seller, every day. One email when your price arrives.
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 71 days · 71 data points (no recent data)
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price Distribution
Price distribution over 71 days • 2 price levels
Price Analysis
Most common price: £108 (55 days, 77.5%)
Price range: £108 - £114
Price levels: 2 different prices over 71 days
Description
Key Features
Copper Interconnect Technology covers advanced laser systems with lower radiation wavelengths for precise microelectronics manufacturing and nanofabrication.
The book integrates materials science, process technology, and applications to address practical challenges in Cu-interconnect systems.
Includes extensive graphs, experimental data, material properties, and technical methods for semiconductor researchers and graduate students.
Written by a recognised leader in the field to provide authoritative guidance on interconnection line manufacturing with copper.
Addresses major technical issues and solutions for implementing copper in modern microelectronics interconnection processes.
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 1489985115
- Domain
- Amazon UK
- Release Date
- 29 November 2014
- Listed Since
- 02 December 2014
Barcode
No barcode data available
Similar Products You Might Like
Copper Interconnect Technology - Springer Engineering Book
Springer
Handbook of Semiconductor Interconnection Technology
CRC Press
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Springer
Advanced Materials for Interconnections (Volume 66) (European Materials Research Society Symposia Proceedings, Volume 66)
Elsevier
Advanced Nanoscale ULSI Interconnects - Springer Technical Reference
Springer
Selected Advances in Nanoelectronic Devices: Logic, Memory and RF: 175 (Lecture Notes in Electrical Engineering, 175)
Springer
Interconnect Analysis and Synthesis - Wiley Engineering
Wiley
Harsh Environment Electronics: Interconnect Materials - Wiley
Wiley
IC Interconnect Analysis - Deep Submicron Circuit Design
Springer
PCB Design Guide to Via and Trace Currents and Temperatures
Artech House
Growth of High Permittivity Dielectrics by High Pressure Sputtering from Metallic Targets (Springer Theses)
Springer
Electromigration in Metals: Fundamentals to Nano-Interconnects
Cambridge University Press
Fundamentals Of Nanotransistors: 6 (LESSONS FROM NANOSCIENCE: A LECTURE NOTES SERIES)
World Scientific Publishing Company
Boundary-Scan Interconnect Diagnosis: 18 (Frontiers in Electronic Testing, 18)
Springer
Mechanical Design of Electronic Systems
College House Enterprises, LLC
Advances in Electrical Engineering and Electrical Machines: 134 (Lecture Notes in Electrical Engineering, 134)
Springer
Compact Transistor Modelling for Circuit Design (Computational Microelectronics)
Springer
Advances in Electrical Engineering and Electrical Machines: 134 (Lecture Notes in Electrical Engineering, 134)
Springer
Electrical Properties of Materials
Oxford University Press
Thermal Management Materials for Electronic Packaging - Wiley
Wiley
Interconnect Technology and Design for Gigascale Integration
Springer
Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment
Springer
Granular Nanoelectronics: 251 (NATO Science Series B:, 251)
Springer
Interconnect Noise Optimization in Nanometer Technologies
Springer