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Springer IC Interconnect Analysis - Deep Submicron Circuit Design

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£110.36 £107.43 £108.07 £108.71 £109.35 £109.99 £110.63 27 July 2026 13 August 2026 31 August 2026 18 September 2026 06 October 2026
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Description

IC Interconnect Analysis examines the critical role of metal interconnections in deep submicron integrated circuit design. As feature sizes scaled below a quarter micron, interconnect behaviour shifted from minor parasitic effects to a dominant factor influencing IC area and performance. This Springer publication covers essential modelling and characterisation of resistance, capacitance, and inductance in on-chip interconnects, providing comprehensive coverage of research developments from the late 1980s onwards. The text addresses the fundamental challenges circuit designers face when interconnect performance becomes the limiting factor in overall chip behaviour, offering practical insights into managing interconnect effects in modern microprocessor and VLSI architectures.

Key Features

IC Interconnect Analysis covers deep submicron circuit design challenges where metal interconnect parasitic effects dominate chip performance and area.

Springer's comprehensive treatment of on-chip resistance, capacitance, and inductance modelling provides essential characterisation techniques for DSM era design.

Detailed exploration of interconnect impact on integrated circuit behaviour shifts focus from active components alone to system-level parasitic management.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
23 March 2013
Listed Since
18 April 2014

Barcode

No barcode data available

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