£101.81

Wiley Harsh Environment Electronics - Interconnect Materials

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£105.71 £101.42 £102.36 £103.29 £104.23 £105.16 £106.10 13 March 2026 23 March 2026 03 April 2026 14 April 2026 25 April 2026

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Description

Master the complexities of electronic packaging in extreme settings with this technical resource from Wiley. This book provides in-depth knowledge on novel materials designed to help electronics function under high-temperature and high-pressure conditions. Readers will explore the current state of research and development regarding lead-free interconnect materials. The text identifies specific technical barriers encountered during the development and manufacture of high-temperature interconnect materials. By examining the complexities introduced by harsh environments, this book offers a clear look at how to maintain performance when conditions become extreme. Whether you are investigating new material alternatives or studying existing techniques, this guide covers the methods used to cope with the impacts of extreme temperature. It is an essential resource for engineers and researchers focused on the advancement of electronic packaging technology and reliable interconnect solutions.

Key Features

Explore novel materials designed for electronics operating under high-temperature and high-pressure conditions.

Review current research and development regarding lead-free interconnect materials for electronic packaging.

Identify technical barriers in the manufacture and development of high-temperature interconnect materials.

Learn various techniques and possible material alternatives to handle the impacts of extreme temperature.

Gain insight into the complexities introduced by harsh environmental conditions on electronic components.

Product Specifications

Brand
Wiley
Format
hardcover
Domain
Amazon UK
Release Date
17 April 2019
Listed Since
16 April 2018

Barcode

No barcode data available

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