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Springer Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)

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£157.56 £94.24 £108.06 £121.87 £135.69 £149.50 £163.32 26 April 2026 09 May 2026 23 May 2026 06 June 2026 20 June 2026

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Description

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
26 January 2004
Listed Since
18 January 2007

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